Semiconductor Wafer Slicing Equipment Market to Reach US$ 1.73 Billion by 2031, Driven by Advanced Chip Manufacturing, AI, and Photovoltaic Expansion | QY Research

Market Summary -
The global market for Semiconductor Wafer Slicing Equipment was estimated to be worth US$ 1,151 million in 2024 and is forecast to reach a readjusted size of US$ 1,726 million by 2031, expanding at a CAGR of 6.3% during the forecast period 2025-2031.

According to QY Research, the newly released report titled "Semiconductor Wafer Slicing Equipment Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031" delivers a comprehensive, data-driven analysis of the global wafer slicing equipment market. The report provides detailed insights into market size evolution, sales volume, pricing trends, production capacity, company market share and ranking, and long-term growth dynamics across semiconductor and photovoltaic manufacturing value chains.

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Sales Volume, Capacity, and Industry Economics -
In 2024, global Semiconductor Wafer Slicing Equipment sales reached approximately 13,865 units, closely aligned with a global production capacity of about 13,900 units, indicating a highly utilized manufacturing base. The average global selling price stood at approximately US$ 83,000 per unit, reflecting the precision engineering and advanced automation embedded in these systems.

The industry-wide gross profit margin ranges between 20% and 30%, depending on equipment configuration, slicing technology, automation level, and regional cost structures. These margins highlight the balance between high technical barriers and intense competition among leading equipment suppliers.

Technology Overview and Product Definition -
Semiconductor Wafer Slicing Equipment refers to highly specialized precision machinery used to cut semiconductor ingots-such as monocrystalline silicon, compound semiconductors, or specialty materials-into ultra-thin wafers. These wafers serve as the foundational substrates for:
► Integrated circuits and logic chips
► Memory devices
► MEMS components
► LED chips
► Photovoltaic solar cells

Key performance requirements include high slicing accuracy, minimal kerf loss, low surface damage, high throughput, and strong process stability, all of which are essential for improving yield and lowering per-wafer manufacturing costs.

Industry Chain Structure and Ecosystem -
The semiconductor wafer slicing equipment industry is deeply integrated across upstream, midstream, and downstream segments:
► Upstream - Silicon crystal growth equipment suppliers, precision diamond wire and blade manufacturers, cutting slurry and coolant providers, precision motors, and automation component suppliers
► Midstream - Wafer slicing equipment manufacturers specializing in blade-based and laser-based cutting technologies
► Downstream - Semiconductor foundries, integrated device manufacturers (IDMs), OSATs, MEMS producers, LED manufacturers, and photovoltaic wafer producers

As semiconductor nodes continue to shrink and wafer diameters increase, downstream customers place growing emphasis on automation, consistency, and reduced material waste, driving continuous equipment upgrades.

Market Drivers and Growth Dynamics -
The Semiconductor Wafer Slicing Equipment market is supported by several long-term structural growth drivers:
► Rising global demand for advanced logic and memory chips
► Expansion of 5G, artificial intelligence (AI), and high-performance computing (HPC)
► Rapid growth of electric vehicles (EVs) and power semiconductors
► Continued capacity expansion in photovoltaic wafer manufacturing
► Technological advances in laser slicing and high-precision blade slicing

Manufacturers are increasingly investing in next-generation slicing systems that offer higher accuracy, lower kerf loss, improved automation, and reduced total cost of ownership, strengthening demand for advanced equipment.

Market Structure and Key Insights -
► The market is technology-intensive and capital-driven
► Asia-Pacific dominates both production and consumption
► Foundries and IDMs remain the largest demand contributors
► Laser slicing technology is gaining traction alongside traditional blade slicing
► Equipment reliability and yield improvement are key competitive differentiators

Despite geopolitical uncertainty and tariff-related risks, sustained investment in semiconductor manufacturing capacity continues to support stable market growth.

Regional Market Outlook -
The report provides detailed regional and country-level analysis covering:
► North America (U.S., Canada, Mexico) - strong demand from advanced logic and R&D fabs
► Europe (Germany, France, UK, Italy, etc.) - focus on automotive semiconductors and specialty devices
► Asia Pacific (China, Japan, South Korea, Southeast Asia, India) - largest manufacturing base and fastest capacity expansion
► South America and Middle East & Africa - emerging markets with niche semiconductor and photovoltaic applications

Competitive Landscape -
The global Semiconductor Wafer Slicing Equipment market is moderately concentrated, with a mix of established global leaders and rapidly advancing regional suppliers.

Key companies profiled in the report include:
DISCO, Tokyo Seimitsu, GL Tech Co., Ltd., ASM, Synova, CETC Equipment, Shenyang Heyan Technology, Jiangsu JingChuang Advanced, Huaten Semiconductor, and Tengsheng Precision.
The report evaluates company market share, technology positioning, production capacity, pricing strategies, and regional expansion plans in detail.

Market Segmentation Highlights -

By Type
► Blade Slicing Equipment
► Laser Slicing Equipment

By Application
► Pure Foundry
► IDM
► OSAT
► LED
► Photovoltaic
► Others

Each segment is analyzed in terms of sales volume, revenue contribution, technical requirements, and future demand potential.

Reasons to Procure This Report -
► Access accurate global and regional market forecasts (2020-2031)
► Understand company market share, ranking, and competitive dynamics
► Evaluate technology trends in wafer slicing and yield optimization
► Identify growth opportunities across semiconductors and photovoltaics
► Support strategic planning, capital investment, and equipment sourcing decisions

Key Questions Answered in the Report -
► What is the current and future size of the global wafer slicing equipment market?
► Which applications are driving the strongest equipment demand?
► Who are the leading equipment suppliers globally?
► How are blade and laser slicing technologies evolving?
► What factors will shape market growth through 2031?

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Table of Content:

1 Market Overview
1.1 Semiconductor Wafer Slicing Equipment Product Introduction
1.2 Global Semiconductor Wafer Slicing Equipment Market Size Forecast
1.2.1 Global Semiconductor Wafer Slicing Equipment Sales Value (2020-2031)
1.2.2 Global Semiconductor Wafer Slicing Equipment Sales Volume (2020-2031)
1.2.3 Global Semiconductor Wafer Slicing Equipment Sales Price (2020-2031)
1.3 Semiconductor Wafer Slicing Equipment Market Trends & Drivers
1.3.1 Semiconductor Wafer Slicing Equipment Industry Trends
1.3.2 Semiconductor Wafer Slicing Equipment Market Drivers & Opportunity
1.3.3 Semiconductor Wafer Slicing Equipment Market Challenges
1.3.4 Semiconductor Wafer Slicing Equipment Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Semiconductor Wafer Slicing Equipment Players Revenue Ranking (2024)
2.2 Global Semiconductor Wafer Slicing Equipment Revenue by Company (2020-2025)
2.3 Global Semiconductor Wafer Slicing Equipment Players Sales Volume Ranking (2024)
2.4 Global Semiconductor Wafer Slicing Equipment Sales Volume by Company Players (2020-2025)
2.5 Global Semiconductor Wafer Slicing Equipment Average Price by Company (2020-2025)
2.6 Key Manufacturers Semiconductor Wafer Slicing Equipment Manufacturing Base and Headquarters
2.7 Key Manufacturers Semiconductor Wafer Slicing Equipment Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Semiconductor Wafer Slicing Equipment
2.9 Semiconductor Wafer Slicing Equipment Market Competitive Analysis
2.9.1 Semiconductor Wafer Slicing Equipment Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Wafer Slicing Equipment Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Wafer Slicing Equipment as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Blade Slicing Equipment
3.1.2 Laser Slicing Equipment
3.2 Global Semiconductor Wafer Slicing Equipment Sales Value by Type
3.2.1 Global Semiconductor Wafer Slicing Equipment Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Semiconductor Wafer Slicing Equipment Sales Value, by Type (2020-2031)
3.2.3 Global Semiconductor Wafer Slicing Equipment Sales Value, by Type (%) (2020-2031)
3.3 Global Semiconductor Wafer Slicing Equipment Sales Volume by Type
3.3.1 Global Semiconductor Wafer Slicing Equipment Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Semiconductor Wafer Slicing Equipment Sales Volume, by Type (2020-2031)
3.3.3 Global Semiconductor Wafer Slicing Equipment Sales Volume, by Type (%) (2020-2031)
3.4 Global Semiconductor Wafer Slicing Equipment Average Price by Type (2020-2031)
4 Segmentation by Automation Level
4.1 Introduction by Automation Level
4.1.1 Fully Automatic
4.1.2 Semi-Automatic
4.2 Global Semiconductor Wafer Slicing Equipment Sales Value by Automation Level
4.2.1 Global Semiconductor Wafer Slicing Equipment Sales Value by Automation Level (2020 VS 2024 VS 2031)
4.2.2 Global Semiconductor Wafer Slicing Equipment Sales Value, by Automation Level (2020-2031)
4.2.3 Global Semiconductor Wafer Slicing Equipment Sales Value, by Automation Level (%) (2020-2031)
4.3 Global Semiconductor Wafer Slicing Equipment Sales Volume by Automation Level
4.3.1 Global Semiconductor Wafer Slicing Equipment Sales Volume by Automation Level (2020 VS 2024 VS 2031)
4.3.2 Global Semiconductor Wafer Slicing Equipment Sales Volume, by Automation Level (2020-2031)
4.3.3 Global Semiconductor Wafer Slicing Equipment Sales Volume, by Automation Level (%) (2020-2031)
4.4 Global Semiconductor Wafer Slicing Equipment Average Price by Automation Level (2020-2031)
5 Segmentation by Equipment Structure
5.1 Introduction by Equipment Structure
5.1.1 Batch Type
5.1.2 Single Type
5.2 Global Semiconductor Wafer Slicing Equipment Sales Value by Equipment Structure
5.2.1 Global Semiconductor Wafer Slicing Equipment Sales Value by Equipment Structure (2020 VS 2024 VS 2031)
5.2.2 Global Semiconductor Wafer Slicing Equipment Sales Value, by Equipment Structure (2020-2031)
5.2.3 Global Semiconductor Wafer Slicing Equipment Sales Value, by Equipment Structure (%) (2020-2031)
5.3 Global Semiconductor Wafer Slicing Equipment Sales Volume by Equipment Structure
5.3.1 Global Semiconductor Wafer Slicing Equipment Sales Volume by Equipment Structure (2020 VS 2024 VS 2031)
5.3.2 Global Semiconductor Wafer Slicing Equipment Sales Volume, by Equipment Structure (2020-2031)
5.3.3 Global Semiconductor Wafer Slicing Equipment Sales Volume, by Equipment Structure (%) (2020-2031)
5.4 Global Semiconductor Wafer Slicing Equipment Average Price by Equipment Structure (2020-2031)
6 Segmentation by Application
6.1 Introduction by Application
6.1.1 Pure Foundry
6.1.2 IDM
6.1.3 OSAT
6.1.4 LED
6.1.5 Photovoltaic
6.1.6 Others
6.2 Global Semiconductor Wafer Slicing Equipment Sales Value by Application
6.2.1 Global Semiconductor Wafer Slicing Equipment Sales Value by Application (2020 VS 2024 VS 2031)
6.2.2 Global Semiconductor Wafer Slicing Equipment Sales Value, by Application (2020-2031)
6.2.3 Global Semiconductor Wafer Slicing Equipment Sales Value, by Application (%) (2020-2031)
6.3 Global Semiconductor Wafer Slicing Equipment Sales Volume by Application
6.3.1 Global Semiconductor Wafer Slicing Equipment Sales Volume by Application (2020 VS 2024 VS 2031)
6.3.2 Global Semiconductor Wafer Slicing Equipment Sales Volume, by Application (2020-2031)
6.3.3 Global Semiconductor Wafer Slicing Equipment Sales Volume, by Application (%) (2020-2031)
6.4 Global Semiconductor Wafer Slicing Equipment Average Price by Application (2020-2031)
7 Segmentation by Region
7.1 Global Semiconductor Wafer Slicing Equipment Sales Value by Region
7.1.1 Global Semiconductor Wafer Slicing Equipment Sales Value by Region: 2020 VS 2024 VS 2031
7.1.2 Global Semiconductor Wafer Slicing Equipment Sales Value by Region (2020-2025)
7.1.3 Global Semiconductor Wafer Slicing Equipment Sales Value by Region (2026-2031)
7.1.4 Global Semiconductor Wafer Slicing Equipment Sales Value by Region (%), (2020-2031)
7.2 Global Semiconductor Wafer Slicing Equipment Sales Volume by Region
7.2.1 Global Semiconductor Wafer Slicing Equipment Sales Volume by Region: 2020 VS 2024 VS 2031
7.2.2 Global Semiconductor Wafer Slicing Equipment Sales Volume by Region (2020-2025)
7.2.3 Global Semiconductor Wafer Slicing Equipment Sales Volume by Region (2026-2031)
7.2.4 Global Semiconductor Wafer Slicing Equipment Sales Volume by Region (%), (2020-2031)
7.3 Global Semiconductor Wafer Slicing Equipment Average Price by Region (2020-2031)
7.4 North America
7.4.1 North America Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
7.4.2 North America Semiconductor Wafer Slicing Equipment Sales Value by Country (%), 2024 VS 2031
7.5 Europe
7.5.1 Europe Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
7.5.2 Europe Semiconductor Wafer Slicing Equipment Sales Value by Country (%), 2024 VS 2031
7.6 Asia Pacific
7.6.1 Asia Pacific Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
7.6.2 Asia Pacific Semiconductor Wafer Slicing Equipment Sales Value by Region (%), 2024 VS 2031
7.7 South America
7.7.1 South America Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
7.7.2 South America Semiconductor Wafer Slicing Equipment Sales Value by Country (%), 2024 VS 2031
7.8 Middle East & Africa
7.8.1 Middle East & Africa Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
7.8.2 Middle East & Africa Semiconductor Wafer Slicing Equipment Sales Value by Country (%), 2024 VS 2031
8 Segmentation by Key Countries/Regions
8.1 Key Countries/Regions Semiconductor Wafer Slicing Equipment Sales Value Growth Trends, 2020 VS 2024 VS 2031
8.2 Key Countries/Regions Semiconductor Wafer Slicing Equipment Sales Value and Sales Volume
8.2.1 Key Countries/Regions Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
8.2.2 Key Countries/Regions Semiconductor Wafer Slicing Equipment Sales Volume, 2020-2031
8.3 United States
8.3.1 United States Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
8.3.2 United States Semiconductor Wafer Slicing Equipment Sales Value by Type (%), 2024 VS 2031
8.3.3 United States Semiconductor Wafer Slicing Equipment Sales Value by Application, 2024 VS 2031
8.4 Europe
8.4.1 Europe Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
8.4.2 Europe Semiconductor Wafer Slicing Equipment Sales Value by Type (%), 2024 VS 2031
8.4.3 Europe Semiconductor Wafer Slicing Equipment Sales Value by Application, 2024 VS 2031
8.5 China
8.5.1 China Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
8.5.2 China Semiconductor Wafer Slicing Equipment Sales Value by Type (%), 2024 VS 2031
8.5.3 China Semiconductor Wafer Slicing Equipment Sales Value by Application, 2024 VS 2031
8.6 Japan
8.6.1 Japan Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
8.6.2 Japan Semiconductor Wafer Slicing Equipment Sales Value by Type (%), 2024 VS 2031
8.6.3 Japan Semiconductor Wafer Slicing Equipment Sales Value by Application, 2024 VS 2031
8.7 South Korea
8.7.1 South Korea Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
8.7.2 South Korea Semiconductor Wafer Slicing Equipment Sales Value by Type (%), 2024 VS 2031
8.7.3 South Korea Semiconductor Wafer Slicing Equipment Sales Value by Application, 2024 VS 2031
8.8 Southeast Asia
8.8.1 Southeast Asia Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
8.8.2 Southeast Asia Semiconductor Wafer Slicing Equipment Sales Value by Type (%), 2024 VS 2031
8.8.3 Southeast Asia Semiconductor Wafer Slicing Equipment Sales Value by Application, 2024 VS 2031
8.9 India
8.9.1 India Semiconductor Wafer Slicing Equipment Sales Value, 2020-2031
8.9.2 India Semiconductor Wafer Slicing Equipment Sales Value by Type (%), 2024 VS 2031
8.9.3 India Semiconductor Wafer Slicing Equipment Sales Value by Application, 2024 VS 2031
9 Company Profiles
9.1 DISCO
9.1.1 DISCO Company Information
9.1.2 DISCO Introduction and Business Overview
9.1.3 DISCO Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.1.4 DISCO Semiconductor Wafer Slicing Equipment Product Offerings
9.1.5 DISCO Recent Development
9.2 Tokyo Seimitsu
9.2.1 Tokyo Seimitsu Company Information
9.2.2 Tokyo Seimitsu Introduction and Business Overview
9.2.3 Tokyo Seimitsu Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.2.4 Tokyo Seimitsu Semiconductor Wafer Slicing Equipment Product Offerings
9.2.5 Tokyo Seimitsu Recent Development
9.3 GL Tech Co., Ltd.
9.3.1 GL Tech Co., Ltd. Company Information
9.3.2 GL Tech Co., Ltd. Introduction and Business Overview
9.3.3 GL Tech Co., Ltd. Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.3.4 GL Tech Co., Ltd. Semiconductor Wafer Slicing Equipment Product Offerings
9.3.5 GL Tech Co., Ltd. Recent Development
9.4 ASM
9.4.1 ASM Company Information
9.4.2 ASM Introduction and Business Overview
9.4.3 ASM Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.4.4 ASM Semiconductor Wafer Slicing Equipment Product Offerings
9.4.5 ASM Recent Development
9.5 Synova
9.5.1 Synova Company Information
9.5.2 Synova Introduction and Business Overview
9.5.3 Synova Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.5.4 Synova Semiconductor Wafer Slicing Equipment Product Offerings
9.5.5 Synova Recent Development
9.6 CETC Equipment
9.6.1 CETC Equipment Company Information
9.6.2 CETC Equipment Introduction and Business Overview
9.6.3 CETC Equipment Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.6.4 CETC Equipment Semiconductor Wafer Slicing Equipment Product Offerings
9.6.5 CETC Equipment Recent Development
9.7 Shenyang Heyan Technology
9.7.1 Shenyang Heyan Technology Company Information
9.7.2 Shenyang Heyan Technology Introduction and Business Overview
9.7.3 Shenyang Heyan Technology Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.7.4 Shenyang Heyan Technology Semiconductor Wafer Slicing Equipment Product Offerings
9.7.5 Shenyang Heyan Technology Recent Development
9.8 Jiangsu JingChuang advanced
9.8.1 Jiangsu JingChuang advanced Company Information
9.8.2 Jiangsu JingChuang advanced Introduction and Business Overview
9.8.3 Jiangsu JingChuang advanced Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.8.4 Jiangsu JingChuang advanced Semiconductor Wafer Slicing Equipment Product Offerings
9.8.5 Jiangsu JingChuang advanced Recent Development
9.9 Huaten Semiconductor
9.9.1 Huaten Semiconductor Company Information
9.9.2 Huaten Semiconductor Introduction and Business Overview
9.9.3 Huaten Semiconductor Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.9.4 Huaten Semiconductor Semiconductor Wafer Slicing Equipment Product Offerings
9.9.5 Huaten Semiconductor Recent Development
9.10 Tengsheng Precision
9.10.1 Tengsheng Precision Company Information
9.10.2 Tengsheng Precision Introduction and Business Overview
9.10.3 Tengsheng Precision Semiconductor Wafer Slicing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
9.10.4 Tengsheng Precision Semiconductor Wafer Slicing Equipment Product Offerings
9.10.5 Tengsheng Precision Recent Development
10 Industry Chain Analysis
10.1 Semiconductor Wafer Slicing Equipment Industrial Chain
10.2 Semiconductor Wafer Slicing Equipment Upstream Analysis
10.2.1 Key Raw Materials
10.2.2 Raw Materials Key Suppliers
10.2.3 Manufacturing Cost Structure
10.3 Midstream Analysis
10.4 Downstream Analysis (Customers Analysis)
10.5 Sales Model and Sales Channels
10.5.1 Semiconductor Wafer Slicing Equipment Sales Model
10.5.2 Sales Channel
10.5.3 Semiconductor Wafer Slicing Equipment Distributors
11 Research Findings and Conclusion
12 Appendix
12.1 Research Methodology
12.1.1 Methodology/Research Approach
12.1.1.1 Research Programs/Design
12.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
12.1.2 Data Source
12.1.2.1 Secondary Sources
12.1.2.2 Primary Sources
12.2 Author Details
12.3 Disclaimer

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