Solving the ESD Problem in Cleanrooms with Low-Static Polyimide Film Tape

Problem

Manufacturers using standard polyimide (PI) film tapes in semiconductor and electronics production faced electrostatic discharge (ESD) risks during high-speed handling, peeling, and high-temperature processing. Conventional PI tapes tend to accumulate static charges, attracting airborne particles and triggering ESD events that damage sensitive ICs, wafers, OLED panels, and fine-pitch circuits. These issues caused yield losses (3-7%), rework, and reliability concerns in cleanroom environments.

Solution

Producers adopted Low-static Polyimide Film Tape, engineered with anti-static or static-dissipative surface treatments while retaining the inherent thermal and mechanical advantages of polyimide. This solution delivered:

Controlled surface resistivity typically in the 108-1011 Ω/sq range
Effective static charge dissipation during peeling and automated handling
High temperature resistance (continuous use up to 260 °C)
Excellent dimensional stability and chemical resistance
Clean removal with minimal residue after high-temperature processing

By suppressing static buildup, low-static PI tape reduced particle attraction and ESD risk without compromising heat resistance or insulation performance.

Result

After implementation, manufacturers achieved clear process improvements:

ESD-related defects reduced by 25-45%
Particle contamination incidents lowered by 20-30%
Overall production yield improved by 4-8 percentage points

Overall, this led to higher production stability, lower rework rates, and improved reliability in advanced electronics manufacturing.

QY Research has recently published a comprehensive market study on Low-static Polyimide Film Tape. Key findings are summarized below.

https://www.qyresearch.com/reports/5554241/low-static-polyimide-film-tape

Core Market Data

Global market size: USD 681 million
CAGR (2024-2030): 7.8%
Average price: USD 8.7 per m2
Annual production: 78 million m2
Gross margin: 38%
Production capacity: 95 million m2

List of Main Players

3M Company (NYSE: MMM, USA)
Nitto Denko (TSE: 6988, Japan)
Saint-Gobain (EPA: SG, France)
Avery Dennison (NYSE: AVY, USA)
Intertape Polymer (TSX: ITP, Canada)
DuPont (NYSE: DD, USA)
Kingboard Chemical (HKEX: 148, China)
LINTEC (TSE: 7966, Japan)
Henkel (XETRA: HEN, Germany)
Sekisui Chemical (TSE: 4204, Japan)
Kolon (KRX: 002020, South Korea)
Dunmore (USA)
CS Hyde (USA)
Shurtape (USA)
Futaba Chemical (Japan)
MG Chemicals (Canada)
tesa (Germany)
Shenzhen KHJ Materials (China)
Taizhou Sunano Energy (China)

1. By Surface Resistivity

106-108 Ω/sq
108-1010 Ω/sq
1010-1011 Ω/sq

2. By Product Type

Low Tack Tape
Medium Tack Tape
High Tack Tape

3. By Application

Semiconductor Manufacturing
PCB Manufacturing
Electronic Assembly
Display Panel Manufacturing
Battery Manufacturing

Case Study for Bidding

Time: July 2024
Supplier: Nitto Denko
Buyer: Advanced Semiconductor Packaging Plant (Taiwan)
Product: Low-static Polyimide Film Tape (ESD-Control Grade)
Quantity: 14.5 million m2
Contract Value: USD 42.1 million
Delivery Timeline: March 2025

Detailed Application Scenario

The semiconductor packaging facility adopted Nitto Denko's low-static polyimide film tape for die protection, lead-frame masking, and high-temperature reflow shielding. During automated handling and tape peeling, the low-static surface effectively dissipated accumulated charges, preventing ESD events and reducing particle attraction in cleanroom environments.

The tape maintained excellent adhesion and dimensional stability throughout processing at temperatures up to 260 °C, while enabling clean, residue-free removal. Compared with conventional PI tapes, the manufacturer significantly reduced ESD-related failures, improved yield consistency, and enhanced overall process reliability. This case demonstrates how low-static polyimide film tape plays a critical role in ESD control, cleanroom stability, and high-reliability electronics manufacturing.

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This release was published on openPR.