Global and U.S. Automatic Test Equipment Market Report, Published by QY Research.

QY Research has released a comprehensive new market report on Automatic Test Equipment (ATE), sophisticated systems used to test, validate, and characterize electronic components and integrated circuits during design verification, wafer probing, and final production testing. ATE plays a critical role in ensuring performance, reliability, and yield across semiconductor manufacturing, electronics assembly, automotive electronics, and high-reliability industrial systems. As chips grow more complex-driven by AI, automotive autonomy, and advanced packaging-this report provides an in-depth assessment of global market size, technology evolution, competitive dynamics, and end-market demand trends.

Core Market Data

Global market size: USD 10.5 billion
CAGR (2024-2030): 7.5%
Average price: USD 0.3 million per unit
Gross margin: 42%
Annual production: 35000 units
Production capacity: 41000 units

List of Main Players

Advantest (TSE: 6857, Japan)
Teradyne (NASDAQ: TER, USA)
Cohu (NASDAQ: COHU, USA)
Changchuan Technology (SZSE: 300604, China)
Huafeng Test & Control (SSE STAR: 688200, China)
Chroma ATE (TWSE: 2360, Taiwan)
SPEA (Private, Italy)
Shibasoku (Private, Japan)
PowerTECH (Private, Taiwan)
Exicon (Private, South Korea)
TESEC (Private, Japan)
UniSiC (Private, China)
UNITEST (Private, Austria)
YTEC (Private, Japan)
AMIDA (Private, China)
Test Research (Private, Taiwan)
STATEC (Private, Austria)
Lorlin Test Systems (Private, UK)
JUNO International (Private, China)
ITEC (Private, Netherlands)
ipTEST (Private, Taiwan)
VX Instruments (Private, Germany)
Prime-rel Electronic (Private, China)
Kewell Power System (Private, China)
POWORLD Electronic (Private, China)
Xinkailai Technology (Private, China)

1. By Test Stage

Wafer-level test
Final package test
System-level test
Burn-in and reliability test

2. By Device Type

Logic & SoC ATE
Memory test systems
Mixed-signal ATE

3. By End Application

Semiconductor manufacturing
Outsourced semiconductor assembly & test
Automotive electronics
Consumer electronics
Industrial electronics

Case Study for Bidding

Time: May 2024
Supplier: Advantest
Buyer: TSMC
Product: High-parallel SoC automatic test equipment for advanced-node AI processors
Quantity: 420 systems
Contract Value: USD 1.35 billion
Delivery Timeline: Q2 2026

Case Study for End Using

End User: Qualcomm

Application: Used for final test and validation of advanced mobile and automotive SoCs.

Installation Location / Usage Stage

Deployed in OSAT and IDM backend test facilities.
Integrated with automated handlers and probe stations.
Operated in high-parallel configurations for throughput optimization.

Purpose

Verifies electrical performance, functionality, and timing.
Screens defective units to protect downstream yields.
Supports binning and quality grading for different market segments.

Effect

Improved test throughput by 22% per line.
Reduced cost per tested device through parallelization.
Enhanced yield learning and process optimization feedback.

Alternative Test Approaches
Manual or bench testing is flexible but unsuitable for high-volume production.
Built-in self-test (BIST) reduces test time but cannot fully replace external validation.
System-level testing only misses early-stage defect detection and increases risk.

Therefore, Automatic Test Equipment remains a cornerstone of the semiconductor value chain, ensuring quality, reliability, and scalability for advanced electronics across AI, automotive, communications, and industrial markets.

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This release was published on openPR.