Why Conventional PI Tape Fails in Cleanrooms, and How Low-Static PI Solves It.

Problem

Manufacturers using conventional polyimide tapes in electronics and semiconductor environments faced electrostatic discharge (ESD) risks during high-speed handling and high-temperature processing. Standard PI tapes tend to accumulate static charges, which can attract particles, cause micro-contamination, and trigger ESD events that damage sensitive ICs, wafers, and flexible circuits. These issues led to higher defect rates, yield loss (3-7%), and reliability concerns in cleanroom manufacturing, especially for advanced packaging, OLED displays, and precision electronics.

Solution

Producers adopted Low-static Polyimide Film Tape, engineered with anti-static or dissipative surface treatments while retaining the intrinsic thermal and mechanical advantages of polyimide. This solution delivered:

Stable surface resistivity typically in the 108-1011 Ω/sq range
Effective static charge dissipation during peeling and handling
High temperature resistance (continuous use up to 260 °C)
Excellent dimensional stability and chemical resistance
Clean removal with minimal residue in high-temperature processes

By suppressing static buildup, low-static PI tape minimized particle attraction and ESD risk without compromising heat resistance or insulation performance.

Result

After adoption, manufacturers reported clear operational improvements:

ESD-related defects reduced by 25-45%
Particle contamination incidents lowered by 20-30%
Overall process yield improved by 4-8 percentage points

Overall, this led to higher production stability, lower rework rates, and improved reliability across semiconductor, display, and electronics manufacturing lines.

QY Research has recently published a comprehensive market study on Low-static Polyimide Film Tape. Key findings are summarized below.

https://www.qyresearch.com/reports/5554241/low-static-polyimide-film-tape

Core Market Data

Global market size: USD 681 million
CAGR (2024-2030): 7.8%
Average price: USD 8.7 per m2
Annual production: 78 million m2
Gross margin: 38%
Production capacity: 95 million m2

List of Main Players

3M Company (NYSE: MMM, USA)
Nitto Denko (TYO: 6988, Japan)
Saint-Gobain (EPA: SGOB, France)
Avery Dennison (NYSE: AVY, USA)
Intertape Polymer (TSX: IPG, Canada)
DuPont de Nemours (NYSE: DD, USA)
Kingboard Chemical (HKEX: 0148, China)
Dunmore (USA)
CS Hyde (USA)
Shurtape Technologies (USA)
Futaba Chemical (Japan)
MG Chemicals (Canada)

1. By Tack Type

Low Tack Tape
Medium Tack Tape
High Tack Tape

2. By Product Type

Silicone Adhesive
Acrylic Adhesive

3. By Application

Semiconductor Manufacturing
PCB Manufacturing
Electronic Assembly
Display Panel Manufacturing
Battery Manufacturing

Case Study for Bidding

Time: July 2024
Supplier: Nitto Denko
Buyer: Advanced Semiconductor Packaging Plant (Taiwan)
Product: Low-static Polyimide Film Tape (ESD-Control Grade)
Quantity: 14.5 million m2
Contract Value: USD 42.1 million
Delivery Timeline: March 2025

Detailed Application Scenario

The semiconductor packaging facility adopted Nitto Denko's low-static polyimide film tape for die bonding protection, lead frame masking, and high-temperature reflow shielding. During automated handling and tape peeling, the low-static surface effectively dissipated accumulated charges, preventing ESD events and reducing particle attraction in cleanroom environments.

The tape maintained excellent adhesion and dimensional stability during high-temperature processes up to 260 °C, while enabling clean removal without residue. Compared with conventional PI tapes, the manufacturer significantly reduced ESD-related failures, improved yield consistency, and enhanced overall process reliability. This case demonstrates how low-static polyimide film tape plays a critical role in ESD control, cleanroom stability, and high-reliability electronics manufacturing.

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This release was published on openPR.