Thermal Release Sheets: An USD 928 Million Market Powering High-Yield Semiconductor Manufacturing

Problem

Manufacturers using conventional adhesive films or mechanical separation methods faced challenges in precision bonding and debonding processes. These materials often required high peel force, left adhesive residue, or caused substrate damage during removal. In electronics, semiconductor packaging, and display manufacturing, such limitations resulted in lower yield rates, longer cycle times, and increased risk of component breakage-especially for thin wafers, fragile glass, and fine-pitch assemblies.

Solution

Producers adopted Thermal Release Sheet, a functional adhesive sheet engineered to sharply reduce adhesion strength when heated to a specific trigger temperature (typically 90-150 °C). This solution delivered:

Strong and stable adhesion at room temperature
Rapid, clean release upon controlled heating
No adhesive residue after debonding
Excellent flatness and dimensional stability during processing

Thermal release technology enabled temporary fixation during grinding, cutting, or transport, followed by effortless separation without mechanical stress.

Result

After implementation, manufacturers achieved significant improvements:

Wafer and glass breakage rates reduced by 20-40%
Processing yield improved by 5-10 percentage points
Debonding time shortened by 30-50%

Overall, this led to higher production efficiency, reduced material loss, and improved reliability in advanced manufacturing environments.

QY Research has recently published a comprehensive market study on Thermal Release Sheet. Key findings are summarized below.

https://www.qyresearch.com/reports/5554234/thermal-release-sheet

Core Market Data

Global market size: USD 928 million
CAGR (2024-2030): 8.3%
Average price: USD 11 per square meter
Annual production: 82 million square meters
Gross margin: 39%
Production capacity: 105 million square meters

List of Main Players

Nitto Denko (TSE: 6988, Japan)
Mitsui Chemicals (TSE: 4183, Japan)
Henkel (XETRA: HEN, Germany)
Avery Dennison (NYSE: AVY, USA)
Berry Global (NYSE: BERY, USA)
Sekisui Chemical (TSE: 4204, Japan)
Kolon Industries (KRX: 002020, South Korea)
tesa (Germany)
Scapa Group (UK)
Mactac (USA)
Taizhou Sunano Energy (China)
Xinst Technology (China)
Shenzhen KHJ Materials (China)
Taiwan Gilliontec (Taiwan)

1. By Release Temperature

Low Temperature Release (60-80°C)
Standard Temperature Release (80-120°C)
High Temperature Release (Over 120°C)

2. By Product Type

PET Based Sheet
Polyolefin Based Sheet
Polyimide Based Sheet

3. By Application

Semiconductor Manufacturing
PCB Manufacturing
Electronic Assembly
Display Panel Manufacturing

Case Study for Bidding

Time: May 2024
Supplier: Nitto Denko
Buyer: Semiconductor Wafer Foundry (Taiwan)
Product: Thermal Release Sheet (120 °C Clean-Release Grade)
Quantity: 18 million m2
Contract Value: USD 68.4 million
Delivery Timeline: January 2025

Detailed Application Scenario

The wafer foundry adopted Nitto Denko's thermal release sheet for temporary bonding during wafer thinning and dicing operations. The sheet provided stable adhesion during grinding and transport, preventing wafer slippage and warpage under high-speed processing conditions.

Upon heating, adhesion strength dropped sharply, enabling clean and stress-free wafer release without residue or cracking. This eliminated secondary cleaning steps and reduced mechanical damage to ultra-thin wafers. By replacing conventional adhesive films, the foundry improved yield consistency, shortened processing cycles, and enhanced overall manufacturing reliability. This project highlights how thermal release sheets play a critical role in advanced semiconductor manufacturing, precision handling, and high-yield production.

About QY Research

QY Research has established close partnerships with over 71,000 global leading players. With more than 20,000 industry experts worldwide, we maintain a strong global network to efficiently gather insights and raw data.

Our 36-step verification system ensures the reliability and quality of our data. With over 2 million reports, we have become the world's largest market report vendor. Our global database spans more than 2,000 sources and covers data from most countries, including import and export details.

We have partners in over 160 countries, providing comprehensive coverage of both sales and research networks. A 90% client return rate and long-term cooperation with key partners demonstrate the high level of service and quality QY Research delivers.

More than 30 IPOs and over 5,000 global media outlets and major corporations have used our data, solidifying QY Research as a global leader in data supply. We are committed to delivering services that exceed both client and societal expectations.

For Inquiries:

USA: +1-626-295-2442

Canada: +1-778-907-6631

China: +86-150-1303-8387

Japan: +81-90-3800-9273

South Korea: +82-2883-1278

India: +91-866-9986-909

Indonesia: +62-818-510-991

Germany: +49-15788468916

Switzerland: +41-765899438

Portugal: +351-910983247

Email: global@qyresearch.com

www.qyresearch.com

This release was published on openPR.