HBM TSV Cleaning Equipment Market Set to Surge - Key Insights You Must Know

HBM TSV Cleaning Equipment Market Size

The global market for HBM TSV Cleaning Equipment was valued at US$ 105 million in the year 2024 and is projected to reach a revised size of US$ 163 million by 2031, growing at a CAGR of 6.3% during the forecast period.

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In 2024, global HBM TSV Cleaning Equipment production reached approximately 209 units, with an average global market price of around US$ 500 K USD per unit. The production capacity for Cryogenic HBM TSV Cleaning Equipment in 2024 was approximately 228 units. The typical gross profit margin for HBM TSV Cleaning Equipment is between 20% and 40%. The HBM TSV (Through-Silicon Via) Cleaning Equipment industry plays a key role in the advanced semiconductor packaging supply chain. Upstream, it relies on precision cleaning chemicals, ultrapure water systems, wet process equipment components, and semiconductor-grade materials. These inputs ensure the removal of particles, residues, and contaminants inside TSV holes during HBM (High Bandwidth Memory) fabrication. Midstream, manufacturers of TSV cleaning tools-such as wet benches, spray systems, and megasonic cleaning equipment-serve HBM packaging and wafer foundries. Downstream, the cleaned TSV wafers are used by HBM memory suppliers and AI/graphics processor manufacturers, including Samsung, SK hynix, Micron, NVIDIA, and AMD, for integration into high-performance computing and AI servers.

By Type
• Single Wafer Cleaning
• Batch Cleaning

By Application
• Pre-Etch Cleaning
• Post-Etch Cleaning

Key Companies
Zeus, IMT Co., Ltd., Lam Research, SEMES, TEL, PSK, SCREEN Semiconductor Solutions, ACM Research, NAURA Technology

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