Press release
Tin Silver Solder: Strengthening Thermal Fatigue Resistance in Advanced Electronics
By switching to SnAgCu solder, Bosch achieved a 20% improvement in solder joint thermal fatigue resistance, significantly enhancing module durability under repeated temperature cycling. The solder also demonstrated superior wetting behavior on nickel barrier finishes, resulting in more consistent joint formation. In addition, void rates were reduced by 15% during high-temperature cycling, lowering the risk of electrical and mechanical failure. Collectively, these performance gains extended the service life of Bosch's automotive power control modules by approximately 10%, helping the company improve long-term reliability while maintaining high production efficiency.
https://www.qyresearch.com/reports/5182170/tin-silver-solder
Core market data:
Global market size: USD 1.8 billion
CAGR (2024-2030): 4.8%
Average price: USD 37,500 per ton
Annual production: 48,000 tons
Gross margin: 25%
Production capacity: 62,000 tons
List of Main players:
Senju Metal (Japan)
Alpha Assembly (USA)
Indium Corporation (USA)
Tamura Corporation (Japan)
KOKI Company (Japan)
Heraeus Electronics (Germany)
Aim Solder (USA)
Nihon Superior (Japan)
Vital New Material (China)
Shenmao Technology (Taiwan)
1. By Composition
Sn96.5Ag3.5
Sn95Ag5
Sn98Ag2
SnAgCu (SAC) Alloys
2. By Form
Solder Wire
Solder Paste
Solder Bar / Ingot
Preform or Ribbon
3. By Melting Point Range
Low-Temperature (230 °C)
4. By Purity Level
Standard Grade (99.9%)
High Purity (99.99%)
Ultra-High Purity (99.999%)
5. By Application
Consumer Electronics
Automotive Electronics
Aerospace and Defense Systems
Semiconductor Packaging
LED and Display Module Manufacturing
Case study for bidding
Time: March 2024
Supplier: Senju Metal
Buyer: Samsung Electronics
Product: Sn96.5Ag3.5 Solder Paste
Quantity: 2,600 tons
Contract Value: USD 108 million
Delivery Timeline: February 2025
Case study for end using
Time: 2023-2024
End user: Bosch Group
Purpose: Automotive power control modules
Quantity: 480 tons of SnAgCu solder
Performance: Increased solder joint thermal fatigue resistance by 20%; improved wetting on nickel barrier finishes; reduced void rate by 15% under high-temperature cycling; extended service life of automotive modules by 10%.
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