Thermal Spray Coatings for Semiconductor Equipment Market Set to Surge - Key Insights You Must Know

Thermal Spray Coatings for Semiconductor Equipment Market Size

The global market for Thermal Spray Coatings for Semiconductor Equipment was valued at US$ 26.1 million in the year 2024 and is projected to reach a revised size of US$ 39.9 million by 2031, growing at a CAGR of 6.3% during the forecast period.

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Chamber particles can reduce the yield of functioning devices on a semiconductor wafer. Thermal spray coatings are applied to PVD chamber shielding components to roughen process surfaces, promote adhesion of process materials and thereby reduce defect density within the components respective process chambers.
Dry etching is an essential nanofabrication technique in the modern-day manufacturing of miniaturized semiconductor devices. The semiconductors undergo physical bombardment by argon ions in dry-etch chambers for selectively removing masked patterns of semiconductor materials. The atmosphere in dry-etch chambers is highly corrosive and involves halogen-containing gases such as fluorine and chlorine that get broken down by plasma into chemically reactive radicals. The process gases and the removed material pose a potential risk of deposition onto the chamber components such as walls, liners, and process kits. To meet these challenges, the etch chambers require internal wear and corrosion-resistant coatings to protect them from the corrosive gases that could otherwise prove detrimental to plasma chamber components and their performance. On the other hand, the particle dropout from chamber walls due to ion bombardment also risks contaminating the etched wafer, causing undesirable process drift.

The report will help the Thermal Spray Coatings for Semiconductor Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

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By Type
• Yttrium Oxide Thermal Spray Powder
• Alumina-based Thermal Spray Powder

By Application
• Semiconductor Etch Equipment
• Deposition (CVD, PVD, ALD)
• Ion Implant Equipment

Key Companies
FUJIMI INCORPORATED, Entegris, Hansol IONES, SEWON HARDFACING CO.,LTD, Saint-Gobain, Oerlikon Balzers, APS Materials, Inc., NGK (NTK CERATE), FEMVIX CORP., Coorstek, CINOS, Yeedex, YMC Co., Ltd., Treibacher Industrie AG, Shin-Etsu Rare Earths

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