Wafer Chemical Mechanical Polishing Machines Market Set to Surge - Key Insights You Must Know

Wafer Chemical Mechanical Polishing Machines Market Size

The global market for Wafer Chemical Mechanical Polishing Machines was valued at US$ 2915 million in the year 2024 and is projected to reach a revised size of US$ 4393 million by 2031, growing at a CAGR of 6.1% during the forecast period.

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Chemical Mechanical Polishing is more commonly known as CMP Polishing. This is the process where the top surface of a wafer is polished with a slurry containing an abrasive grit, suspended within reactive chemical agents. The polishing action is partly mechanical and partly chemical. The mechanical element of the process applies downward pressure while the chemical reaction that takes place increases the material removal rate and this is usually tailored to suit the type of material being processed.

The top 2 companies hold a share about 80%. Asia-Pacific is the largest market, with a share about 75%, followed by North America with the share about 13%.

By Type
• Copper CMP Machines
• Silicon Oxide CMP Machines
• Front-end Tungsten CMP Machines
• Interlayer Dielectric Layer CMP Machines
• Wafer Silicon Surface CMP Machines
• Polysilicon CMP Machines
• Shallow Trench Isolation CMP Machines

By Application
• IDM
• Foundry

Key Companies
Applied Materials, Ebara Corporation, KCTech, ACCRETECH, Tianjin Huahaiqingke, Logitech, Revasum, Alpsitec

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