Press release
Copper Barrier CMP Slurries for Metal Removal Market Set to Surge - Key Insights You Must Know
Copper Barrier CMP Slurries for Metal Removal MarketThe global market for Copper Barrier CMP Slurries for Metal Removal was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
North American market for Copper Barrier CMP Slurries for Metal Removal is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Copper Barrier CMP Slurries for Metal Removal is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
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The major global manufacturers of Copper Barrier CMP Slurries for Metal Removal include CMC Material, DuPont, Fujifilm, Ferro, Merck(Versum Materials), Fujimi Corporation, Hitachi, Anjimirco Shanghai, Showa Denko Materials, Soulbrain, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
By Type
• Non-aqueous copper barrier slurry
• Aqueous Copper Barrier Slurries
By Application
• Low-K and ULK Dielectrics
• Etch Hard Masks
• ARC Layers
Key Companies
CMC Material, DuPont, Fujifilm, Ferro, Merck(Versum Materials), Fujimi Corporation, Hitachi, Anjimirco Shanghai, Showa Denko Materials, Soulbrain
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