Plastic Parts for Semiconductor Equipment Market Share Driven by Advanced Fabrication Processes and Material Innovation | Valuates Reports

Plastic Parts for Semiconductor Equipment Market Size
The global market for Plastic Parts for Semiconductor Equipment was valued at US$ 503 million in the year 2024 and is projected to reach a revised size of US$ 703 million by 2031, growing at a CAGR of 5.0% during the forecast period.

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The Plastic Parts for Semiconductor Equipment market is expanding steadily as semiconductor manufacturers increasingly rely on high-performance polymer components to support advanced fabrication environments. Market trends indicate rising demand for materials that offer chemical resistance, thermal stability, and dimensional precision in critical process tools. The market size is influenced by ongoing upgrades in semiconductor fabs, tighter process tolerances, and the growing complexity of deposition, etching, and cleaning operations, all of which are reinforcing long-term market growth.

Among type segments, PEEK parts hold the largest market share due to their superior mechanical strength, high temperature resistance, and excellent chemical compatibility across multiple semiconductor processes. PPS parts are also widely adopted for their balance of performance and cost, particularly in corrosive environments. PI and PAI parts are witnessing faster market growth as advanced nodes require materials capable of withstanding extreme thermal and plasma conditions. Other materials such as PEI, PET, and PC parts continue to support niche applications, contributing to overall market diversity and stability.

From an application perspective, deposition equipment including CVD, PVD, and ALD represents the leading segment, driven by extensive use of plastic components in chamber liners, fixtures, and fluid handling systems. Etching and cleaning equipment are showing strong market growth as process intensity increases and contamination control becomes more critical. CMP and other applications also contribute meaningfully to market share, reflecting the broad integration of engineered plastics across semiconductor manufacturing workflows.

The competitive landscape is shaped by established material suppliers and specialized component manufacturers such as Mitsubishi Chemical, Victrex, Solvay, Ensinger, PBI Performance Products, and CDI Products. These companies maintain strong market share through proprietary polymer formulations, precision machining capabilities, and close collaboration with semiconductor equipment OEMs. Emerging and regional players including Willbe S&T, CALITECH, UIS Technologies, and Shen-Yueh Technology are expanding rapidly by focusing on customized solutions, fast turnaround times, and localized supply chains.

Regionally, North America and Europe maintain significant market share due to their concentration of semiconductor equipment manufacturers and advanced materials expertise. Asia-Pacific dominates consumption, led by China, Japan, and South Korea, where large-scale semiconductor fabrication and capacity expansion drive sustained demand. Southeast Asia and other emerging regions are gaining traction as manufacturing footprints diversify. The market forecast remains positive, supported by continued investment in semiconductor fabrication, increasing material innovation, and the critical role of high-performance plastic parts in enabling next-generation chip production.

Segment by Type

• PPS Parts
• PEEK Parts
• PET Parts
• PI (Polyimide/PAI) Parts
• PEI (Polyetherimide) Parts
• PC Parts
• Others

Segment by Application

• Deposition (CVD, PVD, ALD)
• CMP
• Etching
• Cleaning Equipment
• Others

By Company

Mitsubishi Chemical, Victrex, Solvay, Willbe S&T, CALITECH, Cnus Co., Ltd., UIS Technologies, Euroshore, PTC, Inc., AKT Components Sdn Bhd, Ensinger, Shen-Yueh Technology, 21st Century Co., Ltd., CDI Products, PBI Performance Products, Inc.

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