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Semiconductor Polishing Liquid Abrasive Particle Market Set to Surge - Key Insights You Must Know

12-10-2025 09:58 AM CET | Advertising, Media Consulting, Marketing Research

Press release from: Valuates Reports

Semiconductor Polishing Liquid Abrasive Particle Market Size

The global market for Semiconductor Polishing Liquid Abrasive Particle was valued at US$ 246 million in the year 2024 and is projected to reach a revised size of US$ 418 million by 2031, growing at a CAGR of 8.1% during the forecast period.

Get Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-4J19568/Global_Semiconductor_Polishing_Liquid_Abrasive_Particle_Market_Research_Report_2025

In semiconductor manufacturing, the polishing process plays a critical role in achieving the desired surface smoothness, flatness, and quality of semiconductor wafers. Semiconductor polishing liquid abrasive particles are essential components used in chemical mechanical planarization (CMP) processes to remove material from the wafer surface effectively and uniformly. Abrasive particles used in semiconductor polishing liquids are typically engineered to have precise sizes and shapes to control material removal rates, surface roughness, and uniformity during the polishing process. Spherical or irregularly shaped particles may be used based on the desired polishing requirements.

North American market for Semiconductor Polishing Liquid Abrasive Particle is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

Asia-Pacific market for Semiconductor Polishing Liquid Abrasive Particle is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The major global manufacturers of Semiconductor Polishing Liquid Abrasive Particle include Nissan Chemical, Nouryon, FUSO, Solvay, Fujimi, Xinanna Electronic Technology, Hubei Dinglong Holding, Juxin Semiconductor Materials, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

By Type
• Silica Sol Abrasive Particles
• Alumina Abrasive Particles
• Cerium Oxide Abrasive Particles

By Application
• Silicon Wafer Polishing
• Metal Wiring Polishing
• Dielectric Layer Polishing

Key Companies
Nissan Chemical, Nouryon, FUSO, Solvay, Fujimi, Xinanna Electronic Technology, Hubei Dinglong Holding, Juxin Semiconductor Materials

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-4J19568/global-semiconductor-polishing-liquid-abrasive-particle

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