Semiconductor Materials for CMP Market Set to Surge - Key Insights You Must Know

Semiconductor Materials for CMP Market Size

The global market for Semiconductor Materials for CMP was valued at US$ 3701 million in the year 2024 and is projected to reach a revised size of US$ 5794 million by 2031, growing at a CAGR of 6.7% during the forecast period.

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Chemical Mechanical Planarization (CMP) is a critical process in semiconductor manufacturing used to smooth and planarize the surface of semiconductor wafers. This process combines both chemical and mechanical forces to remove material from the wafer surface, ensuring a flat and even surface necessary for subsequent photolithography and layer deposition steps in integrated circuit fabrication.

This report studies the semiconductor materials for CMP, include CMP Slurry, CMP Pads and CMP ancillaries (Pad-Conditioners, Filters, Rings, and Brushes).

CMP Pad is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes.

CMP slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning and is utilized after every deposition-etch step.

CMP ancillaries include CMP Pad Conditioners, CMP POU Slurry Filters, CMP PVA Brushes and CMP Retaining Rings.

CMP pad conditioners, are the chemical mechanical planarization regulator of a polishing pad, and are employed to condition a polishing pad to restore the pad planarity and surface roughness, which are specialized tools used in the semiconductor manufacturing process. They play a critical role in maintaining the performance and efficiency of CMP pads, which are used to polish wafers in the production of integrated circuits.

CMP Slurry Filters are designed to maximize many different semiconductor processes performance by controlling the size, and concentration of slurry particles. Cutting edge CMP filtration technologies lead to higher yields and less defects. By implementing industry leading filter designs, slurry particle size, and quantity of Large Particle Counts (LPCs) can be controlled to specified process parameters.

The semiconductor CMP materials has developed for several decades and displayed a high degree of market concentration. The market is dominated by few manufacturers from U.S. Europe, and Japan.

In terms of CMP slurry, the top eight players hold a share about 77 percent in 2023. After Acquisition of electronic Chemicals Business from Entegris, Fujifilm will be the largest manufacturer of CMP slurries. Other key players include Resonac, Fujimi Incorporated, DuPont, Merck KGaA (Versum Materials), AGC, KC Tech, and Anjimirco Shanghai, etc.

In terms of CMP pads, DuPont is the largest manufactuer, with a share over 66% in 2023, Other key players include Fujifilm (acquired Entegris electronic Chemicals Business), Fujibo Group, Hubei Dinglong, IVT Technologies Co, Ltd., etc.

Globa manufactuers of CMP Pad conditioners include 3M, Kinik Company, Saesol, and Entegris. The top five manufacturers occupied for nearly 90 percent of global market.

By Type
• CMP Slurry
• CMP Pads
• CMP Pad Conditioners
• CMP POU Slurry Filters
• CMP PVA Brushes
• CMP Retaining Rings

By Application
• 300 Wafers
• 200 Wafers

Key Companies
Fujifilm, Resonac, Fujimi Incorporated, DuPont, Merck KGaA (Versum Materials), AGC, KC Tech, JSR Corporation, Anjimirco Shanghai, Soulbrain, Saint-Gobain, Ace Nanochem, Dongjin Semichem, Vibrantz (Ferro), WEC Group, SKC (SK Enpulse), Shanghai Xinanna Electronic Technology, Hubei Dinglong, Beijing Hangtian Saide, Fujibo Group, 3M, FNS TECH, IVT Technologies Co, Ltd., TWI Incorporated, KPX Chemical, Engis Corporation, TOPPAN INFOMEDIA, Samsung SDI, Entegris, Pall, Cobetter, Kinik Company, Saesol Diamond, EHWA DIAMOND, Nippon Steel & Sumikin Materials, Shinhan Diamond, BEST Engineered Surface Technologies, Willbe S&T, CALITECH, Cnus Co., Ltd., UIS Technologies, Euroshore, PTC, Inc., AKT Components Sdn Bhd, Ensinger, CHUANYAN, Zhuhai Cornerstone Technologies, Konfoong Materials International, Tianjin Helen, Shenzhen Angshite Technology, Advanced Nano Products Co.,Ltd, Zhejiang Bolai Narun Electronic Materials, Xiamen Chia Ping Diamond Industrial

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