CMP Slurry for GaN Wafer (GaN Substrate) Market Set to Surge - Key Insights You Must Know

CMP Slurry for GaN Wafer (GaN Substrate) Market Size

The global market for CMP Slurry for GaN Wafer (GaN Substrate) was valued at US$ 9.8 million in the year 2024 and is projected to reach a revised size of US$ 39.3 million by 2031, growing at a CAGR of 22.3% during the forecast period.

This report focuses on the CMP slurry for Gallium Nitride (GaN), typical slurries include Saint-Gobain's GaiN 200, Fujimi's COMPOL EX-3, and Entegris' Nitride Slurries, etc. GaN CMP slurries are used to optimize the polishing process in the chemical mechanical planarization (CMP) of GaN wafers.

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Key players of GaN wafers include Sumitomo Electric Device Innovations (SEDI) (SCIOCS), BTOZ, Suzhou Nanowin Science and Technology, Sanan Optoelectronics, Sino Nitride Semiconductor, Okmetic, Toyoda Gosei, Mitsubishi Chemical, Kyma Technologies, Eta Research Ltd, and Goetsu Semiconductor Wuxi, etc.

According to our research, the global market size of GaN devices (including RF GaN and Power GaN) was approximately US$1.9 billion in 2023, of which RF GaN devices accounted for more than 85%. It is expected that GaN Power devices will maintain faster growth in the next few years. In the next few years, with the advancement of GaN substrate technology, CMP polishing liquid will usher in rapid growth.

By Type
• Colloidal Silica Polishing Slurry
• Alumina Polishing Slurry

By Application
• 4inch GaN Wafer
• 2 inch GaN Wafer

Key Companies
Fujifilm, Saint-Gobain, Fujimi Corporation, Anjimirco Shanghai

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