Chemical Mechanical Planarization Slurry Market Set to Surge - Key Insights You Must Know

Chemical Mechanical Planarization Slurry Market

The global market for Chemical Mechanical Planarization Slurry was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

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Chemical mechanical planarization paste is a type of chemical sol used in semiconductor manufacturing and other microelectronics applications, commonly referred to as CMP paste. It consists of a chemical solution mixed with an abrasive used to perform chemical mechanical planarization (CMP) on the surface of semiconductor devices.

North American market for Chemical Mechanical Planarization Slurry is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

Asia-Pacific market for Chemical Mechanical Planarization Slurry is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The major global manufacturers of Chemical Mechanical Planarization Slurry include CMC Materials, Inc, Hitachi Chemical Co Ltd., Fujifilm Corporation, Fujimi Corporation, Dow Inc., Saint-Gobain Ceramics & Plastics, Inc, Showa Denko K.K, Eminess Technologies Inc, Versum Materials Inc, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

By Type
• Alkaline CMP Slurry
• Acidic CMP Slurry

By Application
• Metal CMP
• Silica CMP
• Other

Key Companies
CMC Materials, Inc, Hitachi Chemical Co Ltd., Fujifilm Corporation, Fujimi Corporation, Dow Inc., Saint-Gobain Ceramics & Plastics, Inc, Showa Denko K.K, Eminess Technologies Inc, Versum Materials Inc

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