Semiconductor Process Equipment (SPE) Market Set to Surge - Key Insights You Must Know

Semiconductor Process Equipment (SPE) Market Size

The global market for Semiconductor Process Equipment (SPE) was valued at US$ 104870 million in the year 2024 and is projected to reach a revised size of US$ 165570 million by 2031, growing at a CAGR of 6.8% during the forecast period.

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The Semiconductor Process Equipment (SPE) are mainly produced in USA, Japan, South Korea, Europe, and China.

The semiconductor etching equipment market is dominated Lam Research, TEL, and Applied Materials. Other players include Hitachi High-Technologies, Oxford Instruments, SPTS Technologies, GigaLane, Plasma-Therm, SAMCO, AMEC, and NAURA etc.

The semiconductor deposition/thin film equipment covers PVD and CVD equipment. The PVD market is dominated by Applied Materials, ULVAC, and Evatec, etc. CVD market is dominated by Applied Materials, Lam Research, TEL, and ASM International, etc. other players include Wonik IPS, Eugene Technology, Eugene Technology, TES, SPTS Technologies (KLA), Veeco, CVD Equipment, Shengyang Piotech, and NAURA.

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Semiconductor metrology and inspection equipment is dominated by KLA-Tencor,
Applied Materials, Hitachi High-Technologies, and ASML. Other players include Onto Innovation, Lasertec, ZEISS, SCREEN Semiconductor Solutions, Camtek, Veeco Instruments, Toray Engineering, Muetec, Unity Semiconductor SAS, Microtronic, RSIC scientific instrument, and DJEL, etc.

The Coater & Developer market is dominated by TEL and SCREEN Semiconductor Solutions. Other players are SEMES, SUSS MicroTec, KINGSEMI, and TAZMO, etc.

The Lithography Machine market is dominated by ASML, Canon, and Nikon.

The semiconductor cleaning equipment market is dominated by SCREEN Semiconductor, Tokyo Electron, and Lam Research.

The Ion Implanter market is dominated by ASML and Axcelis Technologies.

The CMP Equipment market is dominated by Applied Materials, Ebara and Hwatsing Technology.

By Type
• Semiconductor Etching Equipment
• Deposition/Thin Film Equipment
• Semiconductor Front-end Inspection & Metrology
• Semiconductor Coater & Developer
• Semiconductor Lithography Machine
• Semiconductor Cleaning Equipment
• Ion Implanter
• CMP Equipment
• Heat Treatment Equipment

By Application
• Foundry and Logic Equipment
• NAND Equipment
• DRAM Equipment
• Silicon Wafer Manufacturing Equipment
• Semiconductor Test Equipment
• Semiconductor Assembly & Packaging Equipment

Key Companies
ASML, Applied Materials, Inc. (AMAT), TEL (Tokyo Electron Ltd.), Lam Research, KLA Pro Systems, SCREEN, NAURA, Advantest, ASM International, Hitachi High-Tech Corporation, Teradyne, Lasertec, DISCO Corporation, Canon U.S.A., Nikon Precision Inc, SEMES, Ebara Technologies, Inc. (ETI), Axcelis Technologies Inc, AMEC, Kokusai Electric, Beijing E-Town Semiconductor Technology, Onto Innovation, Aixtron, NuFlare Technology, Inc., ACM Research, Veeco, Wonik IPS, Piotech, Inc, Hwatsing Technology, SUSS MicroTec REMAN GmbH, ULVAC TECHNO, Ltd., Kingsemi, Eugene Technology, PSK Group, Jusung Engineering, Oxford Instruments, Skyverse Technology, PNC Technology Group, TES CO., LTD, Samco Inc., Wuhan Jingce Electronic Group, Plasma-Therm, Grand Process Technology, Advanced Ion Beam Technology, Inc. (AIBT), Skytech Group, CVD Equipment, RSIC scientific instrument (Shanghai), GigaLane, Shanghai Micro Electronics Equipment

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