DRAM for Data Centers Market Set to Surge - Key Insights You Must Know

DRAM for Data Centers Market Size

The global market for DRAM for Data Centers was valued at US$ 6200 million in the year 2024 and is projected to reach a revised size of US$ 11030 million by 2031, growing at a CAGR of 7.3% during the forecast period.

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This report studies the DRAM for data centers, mainly incldue DIMM.

DIMM stands for Dual-Inline Memory Modules, which refers to dual in-line memory modules. Server DIMMs are memory modules installed on server motherboards, primarily used to expand the system's memory capacity and support large-scale data processing and multitasking operations.

The main types of server DIMMs include UDIMM, SODIMM, RDIMM, MRDIMM, and LRDIMM.

Server DIMMs are mainly applied in data centers and cloud computing, high-performance computing (HPC), and enterprise applications. As data processing demands continue to rise and new technologies emerge, the future development trends of server DIMMs are expected to include higher bandwidth and lower latency, increased capacity along with enhanced energy efficiency, heterogeneous memory integration, modular and chip-level integration, and intelligent as well as adaptive management.

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Globally, the server DIMM market is continuously evolving. Future development will focus on achieving higher speeds, larger capacities, lower power consumption, and integration with new storage technologies to support the ever-growing demands of cloud computing, big data, and high-performance computing.

North American market for DRAM for Data Centers is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

By Type
• UDIMM
• SODIMM
• RDIMM
• MRDIMM
• LRDIMM

By Application
• IDC (Internet Data Center)
• EDC (Enterprise Data Center)

Key Companies
Samsung, SK Hynix, Micron Technology, Changxin Memory Technologies (CXMT), Kingston Technology Company, Inc., SMART Modular Technologies, ADATA Technology, Rambus, Kimtigo, Transcend, Innodisk, TeamGroup, Apacer Technology, G.SKILL, Shenzhen Longsys, Ramaxel

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This release was published on openPR.