Press release
Electronic Grade Trisilylamine Market Updated Market Insight With Market Values & CAGR 16.0%
Electronic Grade Trisilylamine Market
The Electronic Grade Trisilylamine (TSA) Market is expanding rapidly as semiconductor manufacturers continue transitioning to advanced node technologies, including 5 nm, 3 nm, and sub-3 nm processes. TSA is now the preferred precursor for low-temperature silicon nitride (SiN) and silicon carbon nitride (SiCN) deposition, offering higher purity, reduced defectivity, and excellent film uniformity compared to traditional precursors.
The global market is valued at USD 147.2 million in 2024 and is projected to reach USD 362.4 million by 2030, growing at an exceptional CAGR of 16.0% during 2024-2030. Growth is fueled by aggressive fab expansions, demand for high-performance chips in AI, EVs, 5G, and hyperscale data centers.
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Market Growth (2024-2030)
• Market Size (2024): USD 147.2 million
• Forecast (2030): USD 362.4 million
• CAGR: 16.0%
Rising adoption of TSA in ALD/CVD processes across leading foundries is a key contributor to this strong growth.
Key Market Drivers
• Rapid transition to next-generation semiconductor nodes
• Increasing deposition of ultra-thin silicon nitride layers for DRAM, logic, and 3D NAND
• Demand for high-purity precursors with low metal contamination
• Expansion of mega fabs in Taiwan, South Korea, the U.S., Japan, and China
• Growing adoption of TSA for low-temperature ALD, enabling improved device reliability
• Increasing use in advanced packaging, including 2.5D/3D integration
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Market Segmentation
By Purity Level
• Less than equal 99.999% (5N)
• Less than equal 99.9999% (6N)
• Ultra-High Purity Electronic Grade (less than 6N)
By Application
• Deposition of Silicon Nitride (SiN)
• Deposition of Silicon Carbon Nitride (SiCN)
• Low-Temperature ALD/CVD
• Gate Spacer Films
• Dielectric Films for Advanced Logic
• Passivation Layers in Memory Devices
By End-Use
• Semiconductor Manufacturing
• Foundries (Logic)
• Memory Manufacturers (DRAM, 3D NAND)
• Advanced Packaging Facilities
• R&D and Pilot Fabs
By Region
• North America
• Europe
• Asia Pacific
• South America
• Middle East & Africa
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Key Market Trends
• Strong shift toward ultra-high-purity TSA as device sizes shrink
• Increased use of TSA for low-temperature dielectric deposition in EUV nodes
• Integration of TSA in leading-edge FinFET and GAAFET architectures
• Rising strategic importance due to the global semiconductor supply chain expansion
• Greater demand from AI processors, GPUs, and EV power electronics
Competitive Landscape
Major companies active in the Electronic Grade Trisilylamine Market include:
• Entegris, Inc.
• Versum Materials (Merck KGaA)
• DNF Co. Ltd.
• Chemical Manufacturers with Specialty Gas Divisions
• Air Liquide
• Gelest, Inc. (Mitsubishi Chemical Group)
• SK Materials
These companies are focused on enhancing purity levels, scaling high-volume production, and developing next-generation precursors compatible with emerging semiconductor architectures.
Recent Developments
• Launch of ultra-high-purity TSA formulations for 3 nm and GAAFET nodes
• New precursor supply agreements with major foundries in Taiwan and South Korea
• Expansion of specialty chemical production plants to support U.S. CHIPS Act projects
• Introduction of transport-stable TSA cylinders optimized for global fab logistics
• Increasing collaboration with ALD equipment makers for process optimization
This report is also available in the following languages : Japanese (電子グレードトリシリルアミン市場), Korean (전자 등급 트리실릴아민 시장), Chinese (电子级三硅胺市场), French (Marché de la trisilylamine de qualité électronique), German (Markt für Trisilylamin in Elektronikqualität), and Italian (Mercato della trisililammina di grado elettronico), etc.
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