Global PCB Electroless Plating Solutions Market Size, Market Share, Industry Analysis Report 2025

On Nov 13, the latest report "Global PCB Electroless Plating Solutions Market 2025 by Manufacturers, Regions, Types and Applications, Forecast to 2031" from Global Info Research provides a detailed and comprehensive analysis of the global PCB Electroless Plating Solutions market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2025.

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According to our (Global Info Research) latest study, the global PCB Electroless Plating Solutions market size was valued at US$ 2611 million in 2024 and is forecast to a readjusted size of USD 3811 million by 2031 with a CAGR of 5.8% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Electroless plating, also known as autocatalytic plating, is a method of depositing a metal coating onto a substrate without the use of an electric current. In the context of printed circuit boards (PCBs), electroless plating is commonly used to deposit metals such as copper, nickel, or gold to create conductive pathways, enhance solderability, and improve corrosion resistance. Electroless Plating Solution is a surface treatment solution that deposits a metal or alloy film on the surface of a material through an autocatalytic chemical reduction reaction.
The types of Electroless Plating Solutions commonly used in the PCB industry include Electroless Plating Copper Solutions, ENIG, ENEPIG, Electroless Plating Silver Solutions, Electroless Plating Tin Solutions, and Electroless Plating Gold Solutions.
From the perspective of different process solution systems, the mainstream Electroless Plating Solutions include ENIG, ENEPIG, Electroless Plating copper, Electroless Plating nickel, Electroless Plating tin, Electroless Plating gold, Electroless Plating silver, etc. Different solution systems have different application scenarios. For example, Electroless Plating nickel is the most widely used, such as PCB, semiconductors, automobiles, industrial machinery, petrochemicals and other scenarios, while ENIG and ENEPIG are mainly used in PCB and semiconductors. At present, Electroless Plating copper solution accounts for the highest proportion in the entire application. With the increase in the market penetration rate of semiconductor advanced packaging substrates, ENIG and ENEPIG are expected to exceed 27% of the market share of ENIG and ENEPIG solutions by 2031 due to their own advantages.
At present, the core manufacturers of Electroless Plating Solutions in the China (Inclued Taiwan) mainly include C. Uyemura & Co, Atotech (MKS), Dupont, MacDermid Enthone Industrial Solutions, JCU Corporation, YMT, MK Chem & Tech Co., Ltd, GHTECH, OKUNO Chemical Industries, etc. It is expected that the industry competition will be more significant in the next few years, and the market will be fragmented, but the high-end application market will still be dominated by leading companies. In the global high-end PCB field, the mainstream companies of Electroless Plating Solutions include Atotech (MKS), MacDermid Enthone Industrial Solutions, etc. These companies still have obvious advantages over Chinese local companies in terms of brand awareness, product technology, etc. In recent years, with the expansion of downstream market demand and the continuous improvement of industry technology level, industries such as PCB, electronic semiconductors, and new energy vehicles are facing good development opportunities. Chinese local manufacturers (GHTECH, Guangzhou Sanfu New Materials Technology Co., Ltd, Guangdong Skychem Technology, etc.) are also gradually emerging in the domestic market in China, relying on their technological innovation and localized services to gradually expand their market share.
This report is a detailed and comprehensive analysis for global PCB Electroless Plating Solutions market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
PCB Electroless Plating Solutions market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type: ENEPIG、 ENIG、 Electroless Gold、 Electroless Copper、 Electroless Tin、 Electroless Silver
Market segment by Application: Multilayer PCB、 HDI、 IC Substrate、 FPC、 Single-Sided and Double-Sided PCB、 Others
Major players covered: C. Uyemura & Co、 Atotech (MKS)、 Dupont、 MacDermid Enthone Industrial Solutions、 OKUNO Chemical Industries、 JCU Corporation、 GHTECH、 Guangdong Skychem Technology、 Shenzhen Baikal Electronic Materials Co., Ltd、 Jetchem、 Guangzhou Sanfu New Materials Technology Co., Ltd、 Shenzhen Chuangzhi Success Technology、 HLHC、 Shenhzen Yicheng、 Shenzhen Hotchain、 Shenzhen ZhengTianWei Science&Technology、 Shenzhen Songbai、 Shenzhen Xingjingwei、 Guangdong Shuo Cheng Technology、 Hubei Harvar、 YMT、 MK Chem & Tech Co., Ltd、 JX Advanced Metals Corp、 KPM Tech Vina

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe PCB Electroless Plating Solutions product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of PCB Electroless Plating Solutions, with price, sales quantity, revenue, and global market share of PCB Electroless Plating Solutions from 2020 to 2025.
Chapter 3, the PCB Electroless Plating Solutions competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the PCB Electroless Plating Solutions breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment PCB Electroless Plating Solutions the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the PCB Electroless Plating Solutions sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2024.and PCB Electroless Plating Solutions market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of PCB Electroless Plating Solutions.
Chapter 14 and 15, to describe PCB Electroless Plating Solutions sales channel, distributors, customers, research findings and conclusion.

The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for PCB Electroless Plating Solutions
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace

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