Chemical Mechanical Polishing Equipment Market Share Driven by Advanced Semiconductor Manufacturing and Wafer Surface Perfection | Valuates Reports

Chemical Mechanical Polishing Equipment Market Size
The global market for Chemical Mechanical Polishing Equipment was valued at US$ 3543 million in the year 2024 and is projected to reach a revised size of US$ 7513 million by 2031, growing at a CAGR of 11.5% during the forecast period.

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The Chemical Mechanical Polishing (CMP) Equipment Market is witnessing strong market growth driven by rapid advancements in semiconductor fabrication and the increasing need for superior wafer planarization. CMP systems play a critical role in achieving defect-free surfaces and precise material removal during chip manufacturing, enabling high-yield and performance in advanced integrated circuits. Market trends highlight a growing shift toward automation, precision control, and material compatibility, fueled by demand from logic, memory, and 3D packaging applications. The global push for smaller node technologies and higher integration density continues to expand the overall market size.

By type, the 300mm polishing machines segment holds the largest market share, supported by extensive adoption in high-volume semiconductor production lines. These systems are essential for manufacturing advanced chips used in data centers, AI processors, and consumer electronics. Meanwhile, 200mm polishing machines maintain a steady demand base, particularly in legacy node manufacturing and specialty device production. The others category, which includes smaller-diameter or customized polishing equipment, caters to research, development, and pilot-scale semiconductor facilities that emphasize flexibility and innovation.

In terms of application, semiconductor plants dominate the CMP equipment market, accounting for the majority of installations due to the ongoing expansion of wafer fabrication facilities and the integration of CMP tools in process steps such as shallow trench isolation, copper interconnect, and dielectric planarization. Research institutes represent a growing application segment, as universities and R&D centers increasingly invest in CMP equipment for material science, device prototyping, and advanced wafer process development. The combination of academic and industrial collaboration continues to enhance market growth and technology diffusion.

The competitive landscape is led by major players such as Applied Materials, Ebara Corporation, KC Tech, ACCRETECH, Tianjin Huahaiqingke, Logitech, Revasum, and Alpsitec. These companies command significant market share through continuous innovation in polishing head design, pad conditioning, slurry delivery, and endpoint detection systems. Strategic initiatives, including product optimization for advanced nodes, enhanced tool modularity, and process automation, are enabling manufacturers to meet evolving semiconductor requirements while maintaining cost and yield efficiency.

From a regional perspective, Asia-Pacific dominates the global CMP equipment market, driven by large-scale semiconductor production in China, Japan, South Korea, and Taiwan. The region benefits from expanding wafer fabrication capacity and supportive government policies promoting semiconductor self-sufficiency. North America follows closely, supported by leading chipmakers investing in advanced manufacturing and R&D facilities. Europe also contributes a notable market share with a focus on precision engineering and equipment development. Emerging markets in Southeast Asia and Latin America are showing gradual growth, supported by increasing investments in electronics assembly and semiconductor research. The market forecast indicates steady expansion, driven by the transition to finer process nodes, growing semiconductor complexity, and the continuous demand for flawless wafer surfaces across global fabrication ecosystems.

by Type

• 300MM Polishing Machine
• 200MM Polishing Machine
• Others

by Application

• Semiconductor Plants
• Research Institutes

By Company

Applied Materials, Ebara Corporation, KC Tech, ACCRETECH, Tianjin Huahaiqingke, Logitech, Revasum, Alpsitec

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