Press release
Global and U.S. Amorphous Boron Nitride Market Report, Published by QY Research.
A thermal management materials company in Japan faced persistent overheating issues in next-generation power modules and high-frequency transistors. Conventional ceramic fillers such as alumina and silica failed to provide sufficient heat dissipation without compromising electrical insulation. To overcome this, the R&D team adopted Amorphous Boron Nitride (a-BN), a non-crystalline compound with exceptional thermal conductivity, chemical stability, and dielectric strength. Its fine particle morphology and isotropic structure allowed uniform dispersion in polymer matrices, forming advanced thermally conductive yet electrically insulating composites. By integrating a-BN into encapsulants and thermal interface materials, the company achieved up to 35% improvement in heat transfer efficiency and extended component lifespan under high operating temperatures. This innovation enabled stable performance in electric vehicle inverters and high-power semiconductor packaging.https://www.qyresearch.com/reports/5431092/amorphous-boron-nitride
Core market data:
Global market size: USD 622 million
CAGR (2024-2030): 5.7%
Average price: USD 63000 per ton
Annual production: 9.8 kilotons
Gross margin: 35%
Production capacity: 12 kilotons
List of Main players:
Heeger Materials (USA)
Accumet Materials (USA)
Edgetech Industries (USA)
Momentive Technologies (USA)
Henze BNP (Germany)
Saint-Gobain (France)
Tokuyama (Japan)
Denka (Japan)
Tanyun Chemical (China)
Pengcheng Advanced Ceramics (China)
1. By Production Method
Thermochemical
Chemical Vapor Deposition
Precursor-Derived
2. By Purity Level
Industrial Grade
High-Purity Grade
Ultra-High-Purity Grade
3. By Application
Electronics & Semiconductor
Aerospace & Defense
Industrial Manufacturing
Advanced Material Production
Case study for bidding
Time: January 2024
Supplier: Momentive Performance Materials
Buyer: Applied Materials, Inc.
Product: High-Purity Amorphous BN Thin Film (CVD-deposited, 99% purity)
Quantity: 620 tons
Contract Value: USD 38 million
Delivery Timeline: December 2024
Detailed Application Scenario
In this project, Applied Materials used Momentive's high-purity amorphous boron nitride films as dielectric and protective layers in semiconductor deposition equipment. The amorphous BN coating provided uniform electrical insulation, minimized contamination, and maintained structural integrity under plasma and high-vacuum conditions.
Its smooth surface and non-wetting characteristics prevented material buildup inside process chambers, extending equipment life and reducing maintenance downtime. The films also withstood repeated thermal cycling above 800°C without structural degradation.
Applied Materials selected amorphous BN due to its excellent dielectric performance, thermal shock resistance, and chemical inertness, outperforming traditional alumina and silicon nitride coatings. The project demonstrated amorphous BN's growing importance as a next-generation insulating and protective material for advanced semiconductor manufacturing and aerospace systems.
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