Global and U.S. High Power CO2 Lasers for Semiconductor Market Report, Published by QY Research.

During the production of advanced semiconductor wafers, a chip manufacturer in South Korea faced severe yield loss caused by microcracks and thermal damage during wafer scribing and via drilling. Traditional solid-state lasers lacked the beam uniformity and cutting efficiency required for thick or multilayer substrates. To address this, the company installed High Power CO2 Lasers, which emit infrared radiation at 10.6 μm wavelength ideal for precise thermal processing of silicon, ceramics, and glass. These lasers provided high energy density, non-contact operation, and stable beam quality for cutting, drilling, and annealing tasks. By integrating them into automated wafer dicing systems, the manufacturer achieved smoother edges, reduced debris, and improved throughput by over 20%, while lowering overall maintenance costs and extending equipment lifespan.

https://www.qyresearch.com/reports/5431433/high-power-co2-lasers-for-semiconductor

Core Market Data

Global market size: USD 640 million
CAGR (2024-2030): 6.8%
Average price: USD 58000 per unit
Annual production: 11 kilounits
Gross margin: 39%
Production capacity: 14 kilounits

List of Main Players

Coherent (USA)
TRUMPF (Germany)
FANUC (Japan)
Mitsubishi Electric (Japan)
Luxinar (UK)
Novanta (USA)
Iradion (USA)
Access Laser (USA)
Kern Technologies (USA)
LightMachinery (Canada)
El.En. Group (Italy)
PRC Laser (USA)
Han's Laser (China)
Wuhan Golden Laser (China)
Universal Laser Systems (USA)
SEI Laser (Italy)
Cutlite Penta (Italy)
Optec Laser Systems (Belgium)

1. By Beam Mode

Continuous-Wave Type
Pulsed Type

2. By Cooling Method

Air-cooled
Water-cooled

3. By Exciting Method

RF-excited
DC-excited

4. By End-Use Sector

Semiconductor Fabrication Plants
Microelectronics & IC Packaging
Optoelectronics Manufacturing
Photovoltaic Manufacturing
MEMS & Sensor Production

Case Study for Bidding

Time: March 2024
Supplier: TRUMPF GmbH + Co. KG (Germany)
Buyer: TSMC (Taiwan Semiconductor Manufacturing Company)
Product: 2.5 kW RF-excited CO2 laser systems for precision wafer marking and trimming
Quantity: 1,200 units
Contract Value: USD 64 million
Delivery Timeline: February 2026

Case Study for End Using

End User: Samsung Electronics (South Korea)

Application: Deployed for thin silicon wafer cutting and dicing in advanced chip packaging lines.

Installation Location

Integrated into wafer dicing and marking systems on semiconductor production floors.
Coupled with robotic wafer handlers and precision motion stages.
Connected to closed-loop cooling and fume extraction units for cleanroom compliance.

Purpose

Enables ultra-precise, debris-free cutting with minimal heat-affected zones.
Supports high-throughput wafer processing with automated laser control.
Ensures superior pattern fidelity and chip yield in 3D packaging processes.

Effect

Improved cutting accuracy by 22% compared to mechanical dicing.
Reduced wafer breakage rate by 31%.
Increased production line efficiency and throughput by 18%.

Alternative Devices

Fiber and solid-state lasers offer shorter wavelengths for micro-processing but lack optimal absorption in silicon and polymeric materials.
Therefore, High Power CO2 Lasers remain indispensable for large-area, high-speed, and thermally efficient processing in semiconductor and electronic component manufacturing.

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This release was published on openPR.