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Semiconductor Back-End Test Equipment Market Size, Trends & Forecasts | Valuates Reports
Semiconductor Back-End Test Equipment Market SizeThe global market for Semiconductor Back-End Test Equipment was valued at US$ 6806 million in the year 2024 and is projected to reach a revised size of US$ 13210 million by 2031, growing at a CAGR of 9.6% during the forecast period.
Semiconductor equipment is mainly divided into front-end equipment and back-end packaging and testing equipment. Front-end equipment is mainly wafer manufacturing equipment, while back-end packaging and testing equipment includes testers (ATE), handlers, probe stations, thinning machines, dicing machines, etc.
This article's statistics on semiconductor back-end test equipment (integrated circuit test equipment) mainly include three types of equipment: testers (ATE), handlers, and probe stations.
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Testers, also known as automated test systems (ATE), are mainly used to conduct comprehensive testing of the functions and performance parameters of wafers and chips. This includes testing of semiconductor discrete devices (such as power semiconductor discrete devices and small signal discrete devices), as well as testing of analog and mixed-signal integrated circuits. This equipment plays an important role in the semiconductor industry chain and is widely used in the main links from chip design verification, testing during wafer manufacturing, to finished product testing after packaging is completed.
Handler is mainly used in the finished product inspection link of the design verification stage and the packaging test stage of integrated circuits. Its core function is to automatically transport the chip to be tested to the test area (that is, the location where the chip is connected to the test equipment and tested). In the test area, the pins of the chip are connected to the functional units of the test equipment through specific wiring. After the test equipment completes the test, it feeds the results back to the Handler, and the Handler identifies, classifies and collects the tested chips based on these test results.
The test machine (ATE) is a special equipment for testing the function and performance of the chip. The Handler and the probe station are special equipment for connecting the tested chips and wafers to the functional modules of the test machine and realizing batch automated testing.
In the wafer inspection stage, the main test equipment used is the probe station and the test machine, while in the chip design verification and finished product testing stages, the main test equipment used is the handler and the test machine.
Semiconductor back-end test equipment is a branch of the entire semiconductor equipment. From the perspective of the distribution of global semiconductor equipment sales regions, the market is mainly concentrated in mainland China and Taiwan, China, and the market share of the two regions will exceed 60% in 2024. However, from the perspective of equipment self-sufficiency, the level of localization in China is still relatively low. High-end semiconductor back-end test equipment manufacturers mainly come from Japan and other countries. In recent years, with the support of national policies, China's semiconductor industry has developed rapidly, and the sales scale of semiconductor back-end test equipment in mainland China has continued to grow. Chinese local companies such as Hangzhou Changchuan, Beijing Huafeng Test & Control Technology, PowerTECH Co., Ltd, and JHT Design Co., Ltd have occupied a certain share in the global back-end test equipment market.
From the perspective of the downstream of the industrial chain, the customer base of semiconductor back-end test equipment presents diversified characteristics, covering four core areas of OSAT, IDM and scientific research institutions, among which packaging and testing companies are the main ones. The differences in the needs of different customers reflect the trend of division of labor refinement and technology upgrading in the semiconductor industry. With the popularization of advanced packaging technologies (such as 3D packaging and system-level packaging), the development trends of test product technology mainly include a large number of tests, fast test speed, multi-functional modules, and high test accuracy. Packaging and testing companies need to use high-precision testing equipment to cope with the testing challenges of complex chips, and rely on big data analysis capabilities to optimize the test process and reduce costs. At the same time, the coexistence and development of equipment of multiple technical levels has also become one of the core development trends of semiconductor equipment.
The growth of the scale of semiconductor back-end test equipment depends on the expansion of the scale of the integrated circuit packaging market. From a technical perspective, the continuous breakthroughs in packaging technology directly push up the threshold of testing technology. Taking 3D packaging as an example, the vertical interconnection structure of through silicon vias (TSVs) needs to be tested at the micron level through a probe station, while the heterogeneous integration of multiple chips in the system-level packaging (SiP) requires ATE equipment to have parallel testing, protocol compatibility, and extreme condition simulation capabilities. From the perspective of industrial chain division of labor, the independent operation of the packaging and testing links strengthens the stickiness of equipment demand. In order to serve global customers, OSAT needs to configure highly flexible handlers and modular ATE systems to adapt to cross-domain orders from consumer electronics to automotive electronics. Terminal application upgrades inject continuous momentum into the equipment market, such as 5G and new energy vehicles.
By Type
• ATE
• Handler
• Probe Station
By Application
• IDM
• OSAT
• Scientific Research
Key Companies
Accretech, TEL, Semics, Fittech, Sidea Semiconductor, FormFactor, Advantest, Teradyne, Cohu, Hangzhou Changchuan Technology, YC Corp, Beijing Huafeng Test & Control Technology, Chroma ATE Inc, Hon Precision, SPEA, Shibasoku, Macrotest, PowerTECH, HON PRECISION, INC, JHT Design Co.,Ltd, Boston Semi Equipment, SESSCO Technologies, SYNAX, Microtec Handling Systems GmbH, Tesec Inc, Techwing, Kanematsu, UENO SEIKI NAGANO, Shanghai Cascol, Shenzhen Semishare, MPI Corporation, Micronics Japan, ASM Pacific Technology, Everbeing, MarTek, Micromanipulator, Signatone Corporation, HiSOL, Inc, KeyFactor Systems, Wentworth Laboratories, APOLLOWAVE, SemiProbe, MicroXact, KeithLink Technology, Ecopia, Shenzhen Cindbest Technology, ESDEMC Technology, Lake Shore Cryotronics, Wuhan Jingce Electronic Technology, Exatron, SEMES, Mirae Corporation, ATECO, Pentamaster, CETC45, Shenzhen Hi-Test Semiconductor Equipment Co., Ltd, Shenzhen Biaopu Semiconductor Technology, Shanghai YOUNG SOUL
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