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Semiconductor Wafer Slicing Equipment Market Size, Trends & Forecasts | Valuates Reports
Semiconductor Wafer Slicing Equipment MarketThe global market for Semiconductor Wafer Slicing Equipment was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Semiconductor wafer slicing equipment is mainly used in the packaging process. It is a device that divides wafers containing many chips into wafer particles one by one.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
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Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Wafer Slicing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Wafer Slicing Equipment.
By Type
• Blade Slicing Equipment
• Laser Slicing Equipment
By Application
• Pure Foundry
• IDM
• OSAT
• LED
• Photovoltaic
Key Companies
DISCO, Tokyo Seimitsu, GL Tech, ASM, Synova, CETC Electronics Equipment Group, Hi-TESI, Tensun, Shenyang Heyan Technology, Jiangsu Jingchuang Advanced Electronic Technology
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