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Wafer Slicing Wire Saws Market Size, Trends & Forecasts | Valuates Reports
Wafer Slicing Wire Saws MarketThe global market for Wafer Slicing Wire Saws was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
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Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
By Type
• Below 8-inch (200 mm)
• 8-inch and Above
By Application
• Silicon Wafer
• SiC Wafer
• Sapphire Wafer
Key Companies
Tokyo Seimitsu, Komatsu, Linton, Meyer & Burger, Slicing Tech, YASUNAGA, Wuxi Shangji Automation, Qingdao Gaoce Technology
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