Global and U.S. Sn-Bi-Cu Lead-free Solder Market Report, Published by QY Research.

Sn-Bi-Cu Lead-Free Solder is an environmentally friendly solder alloy composed mainly of tin (Sn), bismuth (Bi), and copper (Cu), designed to replace traditional lead-based solders in electronic assembly. The alloy provides a low melting point, good wettability, and strong mechanical strength, making it suitable for temperature-sensitive components and fine-pitch surface-mount applications. Bismuth reduces the melting temperature and enhances strength, while copper improves joint reliability and resistance to electromigration. This combination delivers excellent solderability, fatigue resistance, and long-term thermal stability. Sn-Bi-Cu solders are extensively used in consumer electronics, automotive electronics, medical devices, and precision instrumentation, where both performance and compliance with RoHS and REACH regulations are essential.

https://www.qyresearch.com/reports/5277187/sn-bi-cu-lead-free-solder

Core market data:

Global market size: USD 1.4 billion
CAGR (2024-2030): 6.3%
Average price: USD 23000 per ton
Annual production: 62 kilotons
Gross margin: 32%
Production capacity: 78 kilotons

List of Main players:

Senju Metal (Japan)
Indium (U.S.)
Nihon Superior (Japan)
Alpha Assembly (U.S.)
KOKI Company (Japan)
Tamura (Japan)
Aim Solder (U.S.)
Henkel (Germany)
Shenzhen Vital (China)
Shenmao Technology (Taiwan)

1. By Composition Ratio

Sn42Bi57.6Cu0.4
Sn40Bi59Cu1
Sn43Bi56.5Cu0.5

2. By Form

Solder Paste
Solder Wire
Solder Bar
Preforms

3. By Melting Temperature

Low-Temperature (135-160°C)
Mid-Temperature (160-190°C)

4. By Application

Consumer Electronics
Automotive Electronics
LED Assembly
Medical Electronics
Aerospace and Defense Systems

Case study for bidding

Time: October 2023

Supplier: Nihon Superior

Buyer: Samsung Electronics

Product: Sn42Bi57.6Cu0.4 Low-Temperature Solder Paste

Quantity: 800 tons

Contract Value: USD 18 million

Delivery Timeline: September 2024

Detailed Application Scenario

In this project, Samsung Electronics used Nihon Superior's Sn-Bi-Cu solder paste for assembling mobile device motherboards and LED backlight units that require precise temperature control during reflow. The alloy's low melting point of around 138°C minimized thermal stress on sensitive components such as chipsets, sensors, and flexible printed circuits.

The inclusion of copper improved solder joint integrity and reduced intermetallic compound growth, enhancing product reliability in devices subjected to vibration and repeated thermal cycling. The paste exhibited strong adhesion, smooth flow, and consistent wetting performance even on fine-pitch and high-density PCBs.

Samsung selected this alloy as part of its lead-free compliance strategy and carbon reduction initiative, replacing traditional Sn-Pb solders to meet global environmental regulations. The Sn-Bi-Cu alloy delivered lower energy consumption during soldering, superior mechanical strength, and excellent joint reliability, making it an ideal choice for high-performance and sustainable electronics manufacturing.

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