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Semiconductor Chemical Mechanical Polishing Material Market Size, Revenue Share, Insights & Future Outlook
Semiconductor Chemical Mechanical Polishing Material Market SizeThe global market for Semiconductor Chemical Mechanical Polishing Material was valued at US$ 2784 million in the year 2024 and is projected to reach a revised size of US$ 4529 million by 2031, growing at a CAGR of 7.3% during the forecast period
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The development trends of the semiconductor mechanical and chemical polishing materials industry are as follows:
The market size expands. With the rapid development of semiconductor, optoelectronics, flat panel display and other industries, the demand for high-precision planarization processing continues to increase, driving the market demand for CMP technology.
Technical level is improved. The CMP technology industry has made significant progress in technology research and development and innovation. Many domestic companies have made important breakthroughs in key technical fields such as CMP equipment, polishing fluids, and abrasive particles, improving product quality and performance.
The industrial chain is complete. The CMP technology industry chain is gradually improving, including equipment manufacturing, material supply, processing services and other links.
Competition in domestic and foreign markets. Domestic companies need to further improve the quality and performance of their products and enhance their brand influence to gain a larger share in the international market.
Policy Support . The Chinese government has always attached great importance to the development of high-tech industries, and the CMP technology industry has also received policy support.
By Type
• CMP Slurry
• CMP Pad
By Application
• Wafer
• Base Material
Key Companies
CMC Materials, DuPont, Fujimi Corporation, Merck KGaA(Versum Materials), Fujifilm, Showa Denko Materials, Saint-Gobain, AGC, Ace Nanochem, Ferro, WEC Group, Anjimirco Shanghai, Soulbrain, JSR Micro Korea Material Innovation, KC Tech, SKC
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