Press release
Pressurize Sintering Silver Paste Market Size, Revenue Share, Insights & Future Outlook
Pressurize Sintering Silver Paste MarketPressure sintering silver paste is an advanced material that applies pressure during the sintering process. It achieves metallurgical bonding between silver particles by mixing silver particles and an organic binder under pressure and subjecting the paste to high-temperature treatment. This sintering method gives the sintered body a higher density and bonding strength due to the pressure it applies, effectively improving electrical and thermal conductivity. While improving the reliability and stability of electronic devices, pressure sintered silver paste can also maintain excellent performance in high-temperature environments. It is an ideal interconnect material in the fields of power electronic packaging and high-end electronic manufacturing. Its unique pressure sintering process ensures the product's superiority in precision and performance, meeting high-demand application scenarios.
The global Pressurize Sintering Silver Paste market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
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North American market for Pressurize Sintering Silver Paste is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Pressurize Sintering Silver Paste is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Pressurize Sintering Silver Paste include Heraeus Electronics, Alpha Assembly Solutions, Indium Corporation, Beijing OLsemi Technology, Shenzhen Jufeng Solder, Sharex New Materials Technology, Guangzhou Xianyi Electronic Technology, SHENZHEN XINYUAN NEW MATERIAL, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
By Type
• Chip Grade
• Non-chip Grade
By Application
• Automotive
• Semiconductor
• Industrial
• LED
Key Companies
Heraeus Electronics, Alpha Assembly Solutions, Indium Corporation, Beijing OLsemi Technology, Shenzhen Jufeng Solder, Sharex New Materials Technology, Guangzhou Xianyi Electronic Technology, SHENZHEN XINYUAN NEW MATERIAL
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