Colovore Joins Global Leaders at DICE to Address the Cooling and Power Demands of Next-Gen Data Centers

Panel to Explore How High-Density Chips Are Reshaping the
Future of Data Center Infrastructure

Panel to Explore How High-Density Chips Are Reshaping the Future of Data Center Infrastructure

Santa Clara, CA - September 18, 2025 - Colovore, the high-density colocation data center provider enabling AI, HPC, and enterprise workloads, announced today that Michael Fulkerson, Vice President of Facilities & Operations, will speak on a featured panel at the DICE Data Center Management, Operations & Cooling-West conference in Santa Clara, CA, taking place October 2, 2025.

The panel, The Future of Data Center Cooling: How Will High Density Chips Impact Cooling and Power Infrastructure?, will explore the escalating technical challenges operators face as GPUs push toward 1000kW per rack. This exponential rise in density is forcing the industry to rethink every layer of facility design from heat rejection and cooling efficiency to power delivery and long-term scalability. Panelists will share how leading organizations are preparing for these near-term realities and what innovations are needed to sustain the next wave of digital infrastructure growth.

Mike Fulkerson Session Details:

WHAT: The Future of Data Center Cooling: How Will High Density Chips Impact Cooling and Power Infrastructure? - Expert Panel Discussion

WHEN: 9:55 AM - 10:50 AM PST on Thursday, October 2, 2025

WHERE: Santa Clara Marriott, 2700 Mission College Blvd. Santa Clara, CA 95054

WHO:

Michael Fulkerson, VP Facilities & Operations, Colovore
Kunal Desai, Sr Manager, Facilities Engineering, Google
Cosimo Pecchioli, Director, IT Hardware & OEM Partnership, BP
Bill Evanger, Director MTDC & High Density Critical Infrastructure, Wesco
Phil Read, Sr Director, Colocation Product Management, Equinix
Calum Devlin, Manager, CoolIT Systems
To learn more about Colovore, visit www.colovore.com.

To register for the DICE conference, please click here.

Media Contact:
Ilissa Miller
iMiller Public Relations
+1.866.307.2510
Email: colovore@imillerpr.com

iMiller Public Relations
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Mamaroneck, NY 10543

About Colovore

Colovore is a pioneer in ultra dense, liquid-cooled data centers, with over a decade of experience supporting next generation chips. The company designs and operates purpose-built infrastructure specifically engineered to support the intense power and cooling requirements of AI, machine learning, and high-performance computing workloads. Colovore's data centers deliver unprecedented power densities from 17kW to 350kW+ per cabinet through advanced liquid-cooling technology-a distinctive capability that has positioned the company at the forefront of the enterprise AI revolution. Initially serving organizations deploying specialized high-performance compute, Colovore has evolved to become the data center partner of choice for mainstream enterprise AI deployments, Fortune 500 companies, and fast-growing technology firms. With operations in Silicon Valley and active expansion into additional Tier I markets, Colovore is strategically scaling its footprint to meet increasing demand. Backed by a team that brings decades of infrastructure management expertise and a commitment to operational excellence, Colovore enables clients to optimize IT footprints, reduce total cost of ownership, and ensure long-term scalability in the AI era.

This release was published on openPR.