Glass Core Substrates for Semiconductor Packaging Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

Glass Core Substrates for Semiconductor Packaging Market Size

The global market for Glass Core Substrates for Semiconductor Packaging was valued at US$ 213 million in the year 2024 and is projected to reach a revised size of US$ 586 million by 2031, growing at a CAGR of 15.7% during the forecast period.

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A glass substrate for semiconductor packaging refers to a specially designed glass material used as a base or platform for constructing and assembling electronic components, particularly semiconductors. It provides a stable and inert surface for mounting and connecting delicate semiconductor devices, such as integrated circuits (ICs), microprocessors, and memory chips. Glass substrates used in semiconductor packaging are engineered to possess specific characteristics that make them suitable for this application. These characteristics include high thermal conductivity, low coefficient of thermal expansion (CTE), electrical insulation properties, chemical resistance, and excellent dimensional stability. The glass substrate serves as a foundation for placing and interconnecting chips, allowing for the creation of complex electronic circuits. Additionally, it can provide protection against moisture, dust, and mechanical stress, enhancing the durability and reliability of the semiconductors. Compared to currently used organic substrates, glass substrates offer better thermal and mechanical stability and ultra-low flatness. These properties promote the increase in chip surface area and the number of chiplets on a single package. A dynamic that allows, in short, to improve the design rules necessary for artificial intelligence products and future data centers by an order of magnitude.

Global key players of Glass Substrate for Semiconductor Packaging include AGC, Schott, Corning, Hoya, Ohara, etc. The top five players hold a share about 90%. Asia-Pacific is the largest market, and has a share about 80%, followed by North America and Europe with share 16% and 3%, separately. In terms of product type, Coefficient of Thermal Expansion (CTE), above 5 ppm/°C is the largest segment, occupied for a share of 65%. In terms of application, Wafer Level Packaging has a share about 60 percent.

By Type
• Coefficient of Thermal Expansion (CTE), above 5 ppm/°C
• Coefficient of Thermal Expansion (CTE), below 5 ppm/°C

By Application
• Wafer Level Packaging
• Panel Level Packaging

Key Companies
AGC, Schott, Corning, Hoya, Ohara, Dai Nippon Printing (DNP), NEG, CrysTop Glass, WGTech

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This release was published on openPR.