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Semiconductor Packaging Market to Reach USD 81.22 Billion by 2030, Driven by Fan-Out WLP and 2.5D/3D IC Adoption
Semiconductor Packaging Market Size & Trends | Mordor Intelligence
Semiconductor Packaging Market Overview
The semiconductor packaging market is undergoing rapid development as chip manufacturers seek better performance, size reduction, and thermal efficiency in increasingly compact and multifunctional devices. As the semiconductor industry moves toward heterogeneous integration and chiplet architectures, packaging technologies are evolving beyond traditional methods to meet new performance and density requirements.
The market is estimated at USD 49.88 billion in 2025 and is projected to reach USD 81.22 billion by 2030, growing at a compound annual growth rate (CAGR) of 10.24% during the forecast period. This growth is fueled by increased demand in sectors such as smartphones, data centers, automotive electronics (especially electric vehicles), and 5G infrastructure.
Report Overview: https://www.mordorintelligence.com/industry-reports/semiconductor-packaging-market?utm_source=openpr
Semiconductor Packaging Market Key Trends
1. Advanced Packaging Technologies Gaining Momentum
The rise in demand for smaller, high-performance devices has brought advanced packaging platforms into the spotlight. Fan-out wafer-level packaging (FOWLP), 2.5D/3D ICs, and system-in-package (SiP) architectures are gaining wide adoption. These technologies provide improved thermal performance and interconnect density, making them suitable for high-end applications like artificial intelligence processors, GPUs, and edge computing chips.
2. Foundries Increasing Focus on Back-End Services
Leading foundries are expanding their packaging portfolios to offer integrated back-end services. This trend supports faster time-to-market and allows semiconductor designers to customize packages tailored to performance and power consumption needs. Foundry-based back-end models are becoming more popular, especially among fabless companies.
3. Rise in Panel-Level Packaging (PLP)
Panel-level packaging is emerging as a high-efficiency solution by enabling more chips to be packaged simultaneously compared to wafer-level processes. Though still in early adoption stages, PLP has potential to reduce overall costs and increase productivity, which is especially important for consumer electronics manufacturers.
4. Surge in Automotive and 5G Applications
The expansion of 5G networks and increased electronic content in vehicles, such as ADAS and power modules for EVs, are creating strong demand for robust and thermally reliable packaging. Automotive-grade packaging must endure extreme conditions, pushing innovations in material and design.
Check out more details and stay updated with the latest industry trends, including the Japanese version for localized insights: https://www.mordorintelligence.com/ja/industry-reports/semiconductor-packaging-market?utm_source=openpr
Semiconductor Packaging Market Segmentation:
By Packaging Platform
Advanced Packaging
Flip-Chip
Fan-Out WLP
Fan-In WLP
2.5D / 3D IC
Embedded-Die
SiP / PoP
Panel-Level Packaging
Traditional Packaging
Wire-Bond
Leadframe
QFN / QFP / SOP
By Packaging Material
Organic Substrates
Leadframes
Bonding Wires
Encapsulation Resins
Ceramic Packages
Solder Balls and Bumps
Die-Attach and TIMs
By Wafer Size
≤ 200 mm
300 mm
≥ 450 mm / Panel
By Business Model
OSAT
Foundry Back-End
IDM In-house
By End-user Industry
Consumer Electronics
Smartphones and Wearables
Computing / Data-Center
Automotive and Mobility
ADAS / EV Power
Communications and Telecom
5G Infrastructure
Aerospace and Defense
Medical and Healthcare Devices
Industrial and Energy (LED / Power)
By Geography
North America
United States
Canada
Mexico
South America
Brazil
Rest of South America
Europe
Germany
France
United Kingdom
Italy
Netherlands
Nordics
Rest of Europe
Middle East and Africa
Israel
Turkey
GCC
South Africa
Rest of Middle East and Africa
APAC
China
Taiwan
South Korea
Japan
India
Singapore
Australia
New Zealand
Rest of APAC
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Key Players
ASE Technology Holding Co., Ltd.: A leading OSAT provider offering advanced packaging like 2.5D/3D IC and SiP, with strong focus on fan-out and system integration for mobile and computing.
Amkor Technology, Inc.: Specializes in wafer-level fan-out and heterogeneous integration, serving automotive, industrial, and networking sectors globally.
JCET Group Co., Ltd.: Delivers a broad range of packaging from traditional leadframes to wafer-level, aligned with China's domestic semiconductor growth.
Siliconware Precision Industries Co., Ltd.: Focuses on memory and logic IC packaging, notably in flip-chip and fan-out technologies for mobile and computing devices.
Powertech Technology Inc.: Offers memory packaging and testing, with emphasis on 3D NAND and high-speed solutions for AI and data-centric applications.
Conclusion
The semiconductor packaging market is expanding across every major end-user segment as companies push for greater performance, power efficiency, and space savings. From smartphones to servers and EVs, packaging innovation has become an integral part of how chips are built and scaled. As OSATs and foundries alike increase their investment in next-gen packaging, the market is expected to maintain strong momentum throughout the decade.
Industry Related Reports
2.5D & 3D Semiconductor Packaging Market
The 2.5D & 3D Semiconductor Packaging Market report segments the industry into By Packaging Technology (3D, 2.5D, 3D Wafer-Level Chip-Scale Packaging (WLCSP) - Qualitative Analysis), By End-User Industry (Consumer Electronics, Medical Devices, Communications And Telecom, Automotive, Other End-User Industries), and By Geography (United States, China, Taiwan, South Korea, Japan, Europe, Latin America, Middle East & Africa).
To know more visit this link: https://www.mordorintelligence.com/industry-reports/global-25d-and-3d-semiconductor-packaging-market?utm_source=openpr
System in Package Technology Market
The System In Package Technology Market report segments the industry into Package (Flat Packages, and more.), Package Technology (2D IC, and more.), Packaging Method (Wire Bond, and more.), Device (Power Management Integrated Circuit (PMIC), and more.), Application (Consumer Electronics, and more.), and Geography (North America, Europe, Asia-Pacific, Latin America, Middle East and Africa).
To know more visit this link: https://www.mordorintelligence.com/industry-reports/system-in-package-technology-market?utm_source=openpr
Power Module Packaging Market
The Power Module Packaging Market Report is Segmented by Component (Substrate, Baseplate, Die Attach, Substrate Attach, Encapsulations, Interconnections, and Other Technologies) and Geography (North America, Europe, Asia-Pacific, and the Rest of the World).
To know more visit this link: https://www.mordorintelligence.com/industry-reports/power-module-packaging-market?utm_source=openpr
For any inquiries or to access the full report, please contact:
media@mordorintelligence.com
https://www.mordorintelligence.com/
Mordor Intelligence, 11th Floor, Rajapushpa Summit, Nanakramguda Rd, Financial District, Gachibowli, Hyderabad, Telangana - 500032, India
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With a team of over 550 domain experts and on-ground specialists spanning 150+ countries, Mordor Intelligence possesses a unique understanding of the global business landscape. This expertise translates into comprehensive syndicated and custom research reports covering a wide spectrum of industries, including aerospace & defense, agriculture, animal nutrition and wellness, automation, automotive, chemicals & materials, consumer goods & services, electronics, energy & power, financial services, food & beverages, healthcare, hospitality & tourism, information & communications technology, investment opportunities, and logistics.
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