High Bandwidth Memory (HBM) for AI Chipsets Market Share Driven by HBM3E Integration and Server Acceleration | Valuates Reports

High Bandwidth Memory (HBM) for AI Chipsets Market Size

The global market for High Bandwidth Memory (HBM) for AI Chipsets was valued at US$ 3816 million in the year 2024 and is projected to reach a revised size of US$ 139450 million by 2031, growing at a CAGR of 68.2% during the forecast period.
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The High Bandwidth Memory (HBM) for AI Chipsets market is expanding at a rapid pace as artificial intelligence workloads demand ultra-fast, power-efficient memory systems to support training and inference at scale. With rising compute complexity and data intensity in AI models, HBM technologies are playing a central role in reshaping memory architecture-fueling market size growth and defining new market trends across servers, networking hardware, and intelligent devices.

By type, HBM3 and HBM3E lead the market share due to their high bandwidth, low latency, and advanced thermal design, making them ideal for AI chipsets deployed in cutting-edge data centers and high-performance computing environments. HBM3E, the latest generation, is gaining rapid traction for its enhanced performance profile, supporting more AI cores and parallel processing demands. HBM2 and HBM2E remain vital to the market, offering a balance between proven reliability and sufficient bandwidth for many current-generation AI accelerators and systems. The "Others" category, including earlier versions and emerging formats, contributes modestly to market size, serving legacy chipsets or specialized applications with lower bandwidth requirements.

In terms of application, the servers segment dominates the market, driven by the widespread integration of HBM-based AI processors in data centers to support neural network training, inference engines, and massive data pipeline operations. Networking products also account for a significant share, as routers and edge devices equipped with AI capabilities require high-speed memory to handle real-time data analysis and traffic optimization. Consumer products-including AI-enabled smartphones, AR/VR systems, and gaming GPUs-are showing consistent growth, fueled by demand for seamless real-time experiences and on-device intelligence. The "Others" category spans industrial automation, automotive AI systems, and embedded AI modules, contributing to market growth through emerging deployments across non-traditional computing environments.

Looking ahead, the market forecast projects strong, sustained growth as AI chipsets continue to scale in complexity, and demand rises for more powerful, efficient memory solutions. The High Bandwidth Memory (HBM) for AI Chipsets market is poised to thrive, supported by rapid adoption of HBM3E, evolving AI architectures, and the global acceleration of AI-driven digital transformation.

by Type

• HBM2
• HBM2E
• HBM3
• HBM3E
• Others

by Application

• Servers
• Networking Products
• Consumer Products
• Others

By Company

SK Hynix, Samsung, Micron Technology, CXMT, Wuhan Xinxin

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