Press release
Precise Control of SMT Reflow Oven Temperature to Improve Welding Quality
Image: https://ecdn6.globalso.com/upload/p/730/image_other/2025-04/precise-control-of-smt-reflow-oven-temperature-5.png [https://www.richpcba.com/pcb-products/]
In the SMT (Surface Mount Technology) production process, the accuracy of reflow oven temperature control directly determines the welding quality and electronic product performance. Even slight deviations can lead to defects such as cold solder joints, voids, or component damage.
Image: https://ecdn6.globalso.com/upload/p/730/image_other/2025-04/precise-control-of-smt-reflow-oven-temperature-1.gif
RICH FULL JOY Electronics, based on extensive PCBA manufacturing experience and technical expertise, has developed the "Reflow Oven Temperature Profile Setting Standard," providing a scientific, systematic, and practical guideline for SMT reflow oven temperature control.
Standard Overview
This standard applies to all reflow ovens in our SMT workshop, with professional SMT engineers responsible for setting and managing temperature profiles to ensure accurate temperature control during welding.
Tools Preparation
To accurately measure and set temperature profiles, the following tools are required: PROFILE tester, thermocouple wires, real PCB boards for measurement, protective gloves, and solder paste specifications.
Setting Standards
1. Reference Basis - Set parameters like ramp-up rate, preheat temperature, and reflow temperature based on the characteristics of different solder pastes (e.g., lead-free, leaded solder pastes).
2. Measurement Basis - Temperature profiles must be measured on real PCB boards to accurately reflect the effects of actual production environments on heat transfer.
3. General Standards
Ramp-up Rate: 1-4/s
Preheat Zone: 150-200, 60-120s
Reflow Zone: greater than or equal to 220 for 30-60s
Peak Temperature: 235-250
Cooling Rate:
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