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MEMS Packaging Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

04-29-2025 08:33 PM CET | Advertising, Media Consulting, Marketing Research

Press release from: Valuates Reports

MEMS Packaging Market Size

The global MEMS Packaging market is projected to grow from US$ 48080 million in 2024 to US$ 85640 million by 2030, at a Compound Annual Growth Rate (CAGR) of 10.1% during the forecast period.

Get Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-38R916/Global_MEMS_Packaging_Market_Insights_Forecast_to_2028

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

By Type
• Inertial Sensors Packaging
• Optical Sensors Packaging
• Environmental Sensors Packaging
• Ultrasonic Sensors Packaging

By Application
• Automotive
• Mobile Phones
• Consumer Electronics
• Medical Systems
• Industrial

Key Companies:
ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., Texas Instruments Incorporated., Taiwan Semiconductor Manufacturing Company Limited, MEMSCAP, Orbotech Ltd., TDK Corporation

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-38R916/global-mems-packaging

Please reach us at sales@valuates.com

Address:
Valuates,
4th Floor,
Balaraj's Arcade,
Whitefield Main road,
Bangalore 560066

Valuates offers an extensive collection of market research reports that helps companies to take intelligent strategical decisions based on current and forecasted Market trends.

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