Aerospace Printed Circuit Board Market is Forecasted to Reach US$ 1.7 billion in 2027, Says Stratview Research

The global aerospace printed circuit board market is projected to witness a growth rate of 5.3% annually from 2022 to 2027, with an anticipated size of US$ 1.7 billion by 2027, according to an analysis by Stratview Research.

Stratview Research, a global market research firm has launched a report on the global aerospace printed circuit board market which provides a comprehensive outlook of the global and regional market, industry forecast, current & emerging trends, segment analysis, competitive landscape, & more.

Click here to get a free sample of the report:
https://www.stratviewresearch.com/Request-Sample/835/aerospace-printed-circuit-board-pcb-market.html#form

Report Highlights:
Market Size in 2027: US$ 1.7 billion
Growth (CAGR): 5.3% during 2022-2027
Forecast Period: 2022-2027
Trend Period: 2016-2020
Base Year: 2021
Number of Segments Covered: 5
Number of Tables & Graphs: 100+

Segment Insights on the Aerospace Printed Circuit Board Market:
The global aerospace printed circuit board market is segmented based on platform type, product type, laminate material type, application type, and region.

Based on platform type - The market is segmented as commercial aircraft, regional aircraft, general aviation, military aircraft, helicopter, spacecraft, and Unmanned Aerial vehicles (UAV). Commercial aircraft is expected to remain the largest and the fastest-growing segment of the market during the forecast period. Increasing miniaturization of components, demand for lightweight yet durable components and parts; strong industry fundamentals; expected market entry of new players, such as COMAC and Irkut; introduction of variants of existing best-selling aircraft programs, such as A320neo and B777X; and rebounding commercial and regional aircraft deliveries across regions, are the key factors propelling the demand for circuit boards in the commercial aircraft segment..

Based on the product type - The market is segmented into rigid 1,2-sided, standard multilayer, flexible, rigid-flex, High-Density Interconnect (HDI)/Microvia/build-up/IC substrate, and others. Standard multilayer held the largest share of the market as it offers various advantages (space and weight savings, high reliability and efficiency, and high assembly density) over other PCB types, making it the preferred choice for multiple applications. HDI/Microvia/build-up/IC substrate is expected to grow with the highest growth during the forecast period due to increasing demand for weight-reduction through miniaturization of components used in various applications. In addition to that, HDI/Microvia/build-up/IC substrate offers various advantages, such as higher performance and space-saving.

Based on the laminate material type - The market is segmented as FR4, polyimide, and others. FR4 is expected to remain the most preferred laminate type in the market during the forecast period. FR4 offers various advantages, such as high strength, excellent moisture resistance, weight savings, lower cost, and fire resistance, which make them the preferred material for a wide array of applications in the aerospace industry such as aerospace probes, navigation systems, radar systems, satellite tracking system, and airplane autopilot.years.

To know the most attractive segments, visit:
https://www.stratviewresearch.com/835/aerospace-printed-circuit-board-pcb-market.html

Which Region Shows the Most Promising Growth Forecast and Opportunity?

The analysis suggests that North America is expected to remain the largest market for aerospace printed circuit boards over the forecast period. This growth outlook is majorly attributed to the following-
- Major factors, such as the presence of major aircraft OEMs, tier players, raw material suppliers, and part fabricators.
- In addition to that, most of the printed circuit board manufacturers have their presence in the region, such as TTM Technologies, Sanmina Corporation, and Amphenol Corporation, to address the emergent needs of OEMs in order to be the partner for their upcoming aircraft programs or upcoming fuel-efficient variants of existing aircraft programs.
- Asia-Pacific is expected to witness the highest growth during the same period propelled by factors such as increasing demand for commercial aircraft to support rising passenger traffic, the opening of assembly plants of Boeing and Airbus in China, the expected launch of COMAC C919, and rising aircraft fleet size.

Aerospace Printed Circuit Board Market Drivers:

Some of the key drivers listed in the report are given below.
- The expected rise in the production rate of key aircraft programs.
- Market entry of upcoming aircraft programs.
- Increasing use of in-flight entertainment (IFE).
- Increasing electronic content in the latest aircraft programs.

Top Companies in the Aerospace Printed Circuit Board Market:
Stratview Research has identified the following companies as the top market players (Based on Dominance).
• TTM Technologies, Inc.
• Sanmina Corporation
• Amphenol Corporation
• AT&S
• Advanced Circuits, Inc.

What Unique Insights Does this Report Offer?

This report provides comprehensive insights into the Aerospace Printed Circuit Board Market, answering critical questions like:

• How big is the sales opportunity?
• Which regions offer the best sales opportunities?
• Which are the most attractive market segments?
• Which are the top players and their market positioning?
• How complex is the business environment?
• What are the factors affecting the market?

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Stratview Research is a global market research firm that highly specializes in aerospace & defense, chemicals, and a few other industries.
It launches a limited number of reports annually on the above-mentioned specializations. Thorough analysis and accurate forecasts in this report enable the readers to take convincing business decisions.
Stratview Research has been helping companies meet their global and regional growth objectives by offering customized research services. These include market assessment, due diligence, opportunity screening, voice of customer analysis, market entry strategies, and more.

This release was published on openPR.