Press release
Surface Mount Technology Equipment Market Set to Reach USD 9.1 Billion by 2031 Amid Surge in Miniaturized Electronics - TMR Analysis
The global surface mount technology (SMT) equipment market is experiencing steady and robust growth, fueled by rising demand for high-performance, miniaturized electronic components across diverse industries. As of 2022, the market stood at USD 5.7 Bn and is projected to expand at a CAGR of 5.9% from 2023 to 2031, reaching USD 9.1 Bn by the end of the forecast period.Surface mount technology, which enables electronic components to be mounted directly onto printed circuit boards (PCBs), is now the cornerstone of modern electronics manufacturing. With increasing demand for lighter, compact, and faster devices, SMT equipment has become essential for manufacturers aiming to boost efficiency, reduce production time, and maintain competitive costs.
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Market Drivers & Trends
One of the primary drivers of this market is the miniaturization of electronic devices. SMT provides a solution that allows manufacturers to reduce product size without compromising performance, aligning with consumer demand for compact smartphones, tablets, wearables, and medical devices.
Additionally, rising automation in electronics manufacturing is further propelling SMT adoption. Automated SMT systems reduce assembly time, improve yield, and lower labor costs critical benefits for high-volume production environments.
Another trend shaping the market is the shift toward lead-free and halogen-free soldering, driven by environmental regulations and the industry's commitment to reducing carbon footprints. Moreover, the increased deployment of flexible printed circuit boards (FPCBs) is boosting SMT equipment demand, particularly in the automotive, aerospace, and healthcare sectors.
Key Players and Industry Leaders
The surface mount technology equipment industry is consolidated, with several major players dominating the global landscape. Key manufacturers include:
ASML Holding, N.V.
Fuji Machine Mfg. Co., Ltd.
Hitachi, Ltd.
Juki Corporation
KLA-Tencor Corporation
Koh Young Technology
Mycronic AB
Nordson Corporation
Orbotech Ltd.
Panasonic Corporation
PARMI Corp.
Test Research, Inc.
Yamaha Motor Co., Ltd.
These companies are actively investing in R&D and new product development while also pursuing strategic mergers and acquisitions to strengthen their global market presence.
Recent Developments
The market has witnessed notable strategic moves and technological innovations:
Yamaha Motors launched the YRM20DL surface mounter, a high-efficiency dual-lane modular system, scheduled for delivery in Q2 2024.
Mycronic AB secured an order for its Prexision 800 Evo mask writer for display-related applications from an Asian customer.
Linx Technologies introduced a surface mount GNSS antenna compatible with major global navigation systems.
Cicor Group acquired Phoenix Mecano Digital Elektronik and Digital Tunisie, expanding its production capabilities.
Summit Interconnect completed the acquisition of Royal Circuit Solutions, becoming one of the largest private PCB manufacturers in North America.
Latest Market Trends
Integration of AI and machine learning in SMT inspection systems to improve defect detection and production line efficiency.
Development of modular SMT platforms to provide flexible manufacturing options for mixed-volume and high-mix production scenarios.
Increased investment in high-speed pick-and-place machines, as manufacturers target greater throughput and precision.
Growing focus on sustainable manufacturing with environmentally friendly soldering methods and materials.
Market Opportunities
The SMT equipment market presents several lucrative opportunities:
Emerging electronics hubs in Asia Pacific, such as Vietnam and India, offer cost-effective manufacturing environments.
Expansion of electric vehicles (EVs), especially in Europe, is fueling demand for complex PCBs requiring advanced SMT equipment.
Rise of 5G technology and smart infrastructure is accelerating the demand for next-generation electronics, thereby enhancing the need for reliable SMT assembly lines.
Medical device innovation wearable and implantable devices requires ultra-compact, precise assembly offered by SMT.
Future Outlook
The market outlook remains optimistic, underpinned by growing adoption across industries and relentless innovation in electronics. As the global economy pivots towards digitalization, the need for reliable, scalable, and sustainable electronics manufacturing will amplify.
With Asia Pacific continuing to lead the charge, driven by major investments in PCB manufacturing, and Europe and North America following suit with strong R&D and automotive electronics initiatives, the SMT equipment market is set for significant expansion through 2031.
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Market Segmentation
By Equipment Type
Placement Equipment, Soldering Equipment, Cleaning Equipment, Inspection Equipment (2D/3D)
By End-use Industry
Consumer Electronics, Automotive, Aerospace & Defense, Healthcare, Industrial, Others
Regional Insights
Asia Pacific dominates the global market, led by China, Japan, South Korea, and Taiwan-countries known for robust electronics manufacturing infrastructure. Vietnam's emergence as a major smartphone exporter adds further momentum.
Europe is expected to see strong growth, supported by government-led EV adoption initiatives like the Electric Vehicles Initiative (EVI) and increasing investment in automotive electronics.
North America is benefitting from academia-industry collaborations that are advancing high-density SMT technologies, along with reshoring initiatives and defense electronics investments.
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Provides in-depth market analysis including drivers, trends, restraints, and opportunities
Covers competitive landscape and company profiles with strategic insights
Analyzes regional dynamics and growth potential across segments
Offers quantitative and qualitative market projections through 2031
Includes latest developments and innovation trends impacting the market
Supports decision-making with Porter's Five Forces and SWOT analysis
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