Press release
Molded Interconnect Device (MID) Industry Report 2025-2034: Market Dynamics, Trends, And Forecasts
Molded Interconnect Device (MID)
What Is the Expected Molded Interconnect Device (MID) Market Size During the Forecast Period?
The molded interconnect device (MID) market has seen a significant expansion in its size in the recent years. Its growth trajectory indicates a surge from $1.75 billion in 2024 to $2.03 billion in 2025, indicating a compound annual growth rate (CAGR) of 16.4%. The factors contributing to this impressive growth during the historic period are primarily the emergence of miniaturization trends, evolution in consumer electronics, increased focus on the development of automotive electronics, innovations in medical devices, and a significant shift towards smart manufacturing.
The market size of the molded interconnect device (MID) is predicted to witness a prominent expansion in the coming few years, reaching up to $3.7 billion in 2029 with a compound annual growth rate (CAGR) of 16.2%. The projected growth during this period can be linked to the continuous transformation of consumer electronics, increase in medical device incorporation, the expansion of automotive electronics, swift prototyping, and advancements in manufacturing. The forecast period is likely to observe significant trends such as adherence to regulatory compliance and quality standards, design customization and flexibility, rapid manufacturing and prototyping techniques, sustainable practices and materials innovation, coupled with industry 4.0 and intelligent manufacturing.
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What Are the High-Growth Segments in the Molded Interconnect Device (MID) Market?
The molded interconnect device (MID) market covered in this report is segmented -
1) By Product: Antenna And Connectivity Modules, Connectors And Switches, Sensors, Lighting
2) By Process: Laser Direct Structuring (LDS), Two-Shot Molding, Other Processes
3) By Application: Automotive, Consumer Products, Healthcare, Industrial, Military And Aerospace, Telecommunication And Computing
Subsegments:
1) By Antenna And Connectivity Modules: Integrated Antennas, RF Modules
2) By Connectors And Switches: Electrical Connectors, Mechanical Switches
3) By Sensors: Temperature Sensors, Pressure Sensors, Proximity Sensors
4) By Lighting: LED Lighting Modules, Decorative Lighting Solutions
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What Key Drivers Are Expected to Influence Future Molded Interconnect Device (MID) Market Growth?
The rise in the need for IoT gadgets is predicted to accelerate the expansion of the molded interconnect devices market. IoT devices are billions of physical objects connected to the internet that collect and share data with other devices and systems online. There is a surge in the popularity of emerging technologies like Internet of Things (IoT), quantum computing, and 5G, along with a growing need in our interconnected world for enhanced computing speed and efficiency, low-energy gadgets, and smart chipsets. This has greatly influenced the dynamics of the semiconductor & electronics industry. For example, a Techjury blog published in August 2022, citing data from IoT Analytics, reported that Smart City (23%), Connected Industry (17%), and Connected Building (12%) were the sectors with the highest number of concrete corporate IoT projects in progress. It also noted that 97% of firms find it challenging to generate value from IoT-related data. As a result, the rising demand for IoT devices is sure to fuel the growth of the molded interconnect devices market.
Which Companies Hold the Largest Share Across Different Molded Interconnect Device (MID) Market Segments?
Major companies operating in the molded interconnect device (MID) market are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG
What Trends Are Driving Growth in The Molded Interconnect Device (MID) Market?
The primary trend gaining momentum in the molded interconnect device market is technological advancement. Many corporations active in the molded connection devices sector are focused on developing state-of-the-art technologies that can be applied in other areas, leading to the progression of technologies like laser plastic welding. For example, in April 2022, SABIC, a chemical company based in Saudi Arabia that produces chemicals, plastics, agri-nutrients, and metals, introduced the LNP THERMOCOMP OFC08V compound. This product provides a high-performance answer for 5G base station dipole antennas and various electrical and electronic applications. The compound is a glass fiber-reinforced product made of polyphenylene sulfide (PPS) resin, developed to facilitate affordable and lightweight all-plastic antenna designs. The product showcases impressive performance in laser direct structuring (LDS) plating, offering excellent layer adhesion, effective warpage management, and reliable dielectric and radio frequency (RF) properties.
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What Are the Emerging Geographies for The Molded Interconnect Device (MID) Market Growth?
Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Frequently Asked Questions:
1. What Is the Market Size and Growth Rate of the Molded Interconnect Device (MID) Market?
2. What is the CAGR expected in the Molded Interconnect Device (MID) Market?
3. What Are the Key Innovations Transforming the Molded Interconnect Device (MID) Industry?
4. Which Region Is Leading the Molded Interconnect Device (MID) Market?
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