SiC Wafer Polishing Market Size, Share, Trends, Competitive Landscape, Regional Analysis Forecasts By 2028 | Expert Review

The SiC wafer polishing market is set for strong growth, driven by rising demand in power electronics, EVs, and 5G applications. Advances in polishing techniques and increasing adoption of SiC in semiconductors will further fuel market expansion, with Asia-Pacific leading due to strong manufacturing capabilities.
The Sic wafer polishing market size is projected to grow from USD 0.4 billion in 2023 to USD 2.2 billion by 2028, registering a CAGR of 37.5% during the forecast period. The Research report presents a complete judgment of the market through strategic insights on Sic wafer polishing market trends [https://www.marketsandmarkets.com/Market-Reports/sic-wafer-polishing-market-71703162.html?utm_source=abnewswire.com&utm_medium=referral&utm_campaign=sic-wafer-polishing], growth factors, supplier landscape, demand landscape, Y-o-Y growth rate, CAGR, pricing analysis. The development of specialized polishing slurries, pads, and other consumables designed specifically for SiC wafer polishing is an important factor in the market. These advanced consumables are formulated to provide superior material removal rates, surface quality, and planarity, facilitating efficient and effective polishing processes that will drive the sic polishing market.

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Power Electronics, by application, is expected to be the most significant Sic wafer polishing Market segment during the forecast period.

Power electronics has the greatest market share in the SiC wafer polishing business, owing to the rapid expansion and demand for energy-efficient electronic gadgets. SiC wafers have distinct advantages in this field, such as strong thermal conductivity and a broad bandgap, making them ideal for power electronic components that require superior performance at high temperatures. With the increasing adoption of electric vehicles, renewable energy systems, and industrial applications, the need for high-power SiC-based devices has increased dramatically.

Chemical mechanical polishing is anticipated to be the fastest-growing Sic wafer polishing Market segment, by process, during the forecast period.

Chemical Mechanical Polishing (CMP) has dominated the SiC wafer polishing market due to its unique ability to provide a highly regulated and exact polishing process. CMP combines chemical reactions with mechanical abrasion to provide better planarization and surface smoothness on SiC wafers, which are required for high-performance semiconductor devices. Its success is also related to its compatibility with diverse SiC substrate types and its capacity to handle larger wafer sizes, answering the semiconductor industry's aspirations for advanced applications. Furthermore, CMP's efficacy in eliminating faults and impurities from SiC wafers makes it a favored alternative for producing reliable and high-quality devices. As a result of these benefits, CMP has the fastest-growing market share in the SiC wafer polishing market, becoming the market leader.

Asia is expected to be the fastest-growing segment in the global Sic wafer polishing Market, by region, during the forecast period.

The Asia Pacific region is experiencing the fastest growth in the SiC wafer polishing market due to its increasing adoption of emerging technologies such as 5G, IoT, and AI, along with a thriving consumer electronics market, robust industrial and automotive sectors, and the presence of established semiconductor manufacturers and technology companies.

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These factors, combined with a growing focus on renewable energy and electric vehicle technologies, have fueled the demand for polished SiC wafers in the region, making it the dominant and rapidly expanding market in the global SiC wafer polishing industry.

SiC wafer polishing Companies [https://www.marketsandmarkets.com/ResearchInsight/sic-wafer-polishing-market.asp?utm_source=abnewswire.com&utm_medium=referral&utm_campaign=sic-wafer-polishing]

Players have adopted different strategies to strengthen their market positions and ensure long-term growth and success. These strategies enable them to efficiently meet the growing demand for types and applications by various industries. Also, companies operating in this market, such as Kemet International (UK), Entegris (US), Fujimi Corporation (Japan), and Saint-Gobain (US), adopt acquisitions, new product launches, agreements, expansions, collaborations, and partnerships to increase their market shares and expand their geographic presence.

Established in 1938, Kemet International Limited is at the forefront of precision lapping and polishing technology, using Diamond Compound and Diamond Slurry, which are manufactured in-house to ISO 9001:2015 quality standards. It offers innovative solutions to operations that demand precision finish and close tolerance. Kemet International Ltd. is a world leader in precision-tailored advanced materials and surface finishing technology. The company specializes in diamond slurries, which are abrasive compounds used for polishing and planarizing semiconductor wafers in the semiconductor industry. These slurries, which are made up of small diamond particles suspended in a liquid carrier, are critical in ensuring smoothness and uniformity in the production of semiconductor devices. Kemet's diamond slurries are engineered to fulfill stringent industry standards, giving remarkable performance and consistency.

The company was established in 1996 in Billerica, Massachusetts, USA. Entegris is a US-based developer, manufacturer, and supplier of products and materials used in semiconductors and other technology processing and production. The firm is divided into three divisions: specialty chemicals and engineered materials, advanced materials handling, and micro-contamination control. Entegris' Specialty Chemicals and Engineered Materials sector provides semiconductors and other sophisticated manufacturing processes with process chemistries, gases, and materials, as well as safe delivery systems.

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This segment's products are used in crucial semiconductor production processes such as cleaning, deposition, and complicated material integration. These materials, when combined with items from other divisions, give solutions to advance semiconductor production processes. Geographically, the company classifies its operations into seven segments, namely North America, Taiwan, South Korea, Japan, China, Europe, and Southeast Asia. In FY2022, the North American segment accounted for 24% of the company's total revenues, followed by Taiwan 20%, South Korea 13%, China 15%, Japan 11%, Europe 10%and Southeast Asia 7%.

The company Fujimi, Inc. produces and sells synthetic precision abrasives. Japan, North America, Asia, and Europe are the four geographic divisions through which the company conducts business. Its offerings include chemical mechanical planarization (CMP) materials necessary for multi-layered circuits on semiconductor chips, polishing abrasives for silicon wafers and other semiconductor substrates, and abrasives for computer hard drives. Additionally, it provides thermal spray abrasives for airplanes, semiconductors, steel, and energy turbines, as well as specialty abrasives for electronic components, lights, vehicles, and lenses. The company's headquarters are in Kiyosu, Japan, and it was established in August 1950. In 2022, the company had a revenue of USD 439.84 million.

Ferro Corporation is a multinational corporation that manufactures materials and chemicals for a variety of industries, including the semiconductor and electronics industries. Ferro, founded in 1919, has developed to become a major provider of innovative electronic materials solutions. The headquarters of the corporation are in Mayfield Heights, Ohio, in the United States. Ferro works globally from this strategic location, supplying customers in varied markets across the world. Ferro, which focuses on the semiconductor and electronics industries, has a diverse product line that includes Chemical Mechanical Planarization (CMP) slurries. CMP slurries are critical in the fabrication of integrated circuits (ICs) because they are used to polish and planarize the semiconductor wafer surfaces. Geographically, the company classifies its revenue into three segments, such as EMEA, the US, Asia Pacific, and Latin America. In FY2021, EMEA contributed 43.2% of the company's total revenue, followed by Americas (41.9%), and Asia Pacific (14.8%).

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