Press release
Electroplating Market Research Report: Key Players and Future Scope 2025-2032
Electroplating Market size was valued at USD 18.3 billion in 2023 and is poised to grow from USD 19.07 billion in 2024 to USD 26.5 billion by 2032, growing at a CAGR of 4.2% during the forecast period (2025-2032).The Research report on Electroplating Market presents a complete judgment of the market through strategic insights on future trends, growth factors, supplier landscape, demand landscape, Y-o-Y growth rate, CAGR, pricing analysis. It also provides and a lot of business matrices including Porters Five Forces Analysis, PESTLE Analysis, Value Chain Analysis, 4 Ps' Analysis, Market Attractiveness Analysis, BPS Analysis, Ecosystem Analysis.
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Segmental Analysis
Type
Pre-treatment Chemicals, Plating Chemicals, Post-treatment Chemicals
Function
Corrosion Protection, Decorative Coatings, Electrical Conductivity, Wear Resistance, Other Functions
End Use
Automotive, Electrical & Electronics, Renewable Energy, Jewellery, Machinery Parts & Components, Others
Market Dynamics
The need for durable and non-corroding, hence more attractive pieces of electronics and automobile industries continues to drive demand for electroplating. For these applications electroplating comes as a technology whose accuracy coupled with effectiveness would enable the correct positioning of desired ions that would work without causing effects to the surfaces where they might find themselves as ions. Thus, the growth in EVs along with sophisticated devices is further spurring the desire for high performing electroplated pieces.
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By Regions and Countries
o North America
o Europe
o Asia-Pacific
o South America
o Middle East & Africa
Following are the players analyzed in the report
MacDermid Enthone Industrial Solutions (US)
Coventya (Germany)
Chemetall (Germany) (Now part of BASF)
Uyemura (Japan)
Okuno Chemical Industries Co., Ltd. (Japan)
Technic Inc. (US)
Taskem, Inc. (US)
Columbia Chemical (US)
SPC (Select Plating Chemicals) (US)
Enthone (US)
JCU Corporation (Japan)
Allied Finishing Inc. (US)
Pioneer Metal Finishing (US)
American Plating Power, LLC (US)
Palm International, Inc. (US)
Asterion, LLC (US)
View report summary and Table of Contents (TOC): https://www.skyquestt.com/report/electroplating-market
The research provides answers to the following key questions:
• What is the estimated growth rate of the market for the forecast period 2024-2031? What will be the market size during the estimated period?
• What are the key driving forces responsible for shaping the fate of the Electroplating Market during the forecast period?
• Who are the major market vendors and what are the winning strategies that have helped them occupy a strong foothold in the Electroplating Market?
• What are the prominent market trends influencing the development of the Electroplating Market across different regions?
• What are the major threats and challenges likely to act as a barrier in the growth of the Electroplating Market?
• What are the major opportunities the market leaders can rely on to gain success and profitability?
About Us:
SkyQuest is an IP focused Research and Investment Bank and Accelerator of Technology and assets. We provide access to technologies, markets and finance across sectors viz. Life Sciences, CleanTech, AgriTech, NanoTech and Information & Communication Technology.
We work closely with innovators, inventors, innovation seekers, entrepreneurs, companies and investors alike in leveraging external sources of R&D. Moreover, we help them in optimizing the economic potential of their intellectual assets. Our experiences with innovation management and commercialization has expanded our reach across North America, Europe, ASEAN and Asia Pacific.
Contact:
Mr. Jagraj Singh
Skyquest Technology
1 Apache Way, Westford,
Massachusetts 01886
USA (!) 351-333-4748
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