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Mold Release Film for Semiconductor Packaging Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports
Mold Release Film for Semiconductor Packaging MarketThe global Mold Release Film for Semiconductor Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
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North American market for Mold Release Film for Semiconductor Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Mold Release Film for Semiconductor Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
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The major global manufacturers of Mold Release Film for Semiconductor Packaging include Nitto Denko, Resonac, Narachem, KOBAYASHI & CO., SANG-A FRONTEC, ELEVEN ELECTRON, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
By Type
• PTFE Film
• PET Film
By Application
• QFN
• FC-CSP (Flip Chip-CSP)
• BGA
Key Companies
Nitto Denko, Resonac, Narachem, KOBAYASHI & CO., SANG-A FRONTEC, ELEVEN ELECTRON
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