Global 3D ICs Market to Log 18.1% CAGR till 2019 with Growing Demand from Consumer Electronics and ICT Industries

According to a recent market research report published by Transparency Market Research, the global 3D ICs market is estimated to expand robustly at a CAGR of 18.1% during the period between 2013 and 2019. The report, titled “Global 3D ICs Market - Industry Analysis, Size, Share, Growth, Trends and Forecast 2013 - 2019”, projects the global 3D ICs market to be worth US$7.52 bn by 2019. The overall market stood at a valuation of US$2.4 bn in 2012.

3D ICs chips are expected to define the future of electronics as they consume 30-40% less power compared to 2D ICs chips. The report points out that the demand for 3D ICs chips would be boosted by the growing demand for efficient solutions and an increase in the number of portable devices. However, high costs, coupled with thermal and testing issues is expected to restrain the growth of the global 3D ICs market during the forecast horizon. The overall market has a huge opportunity to grow with advancements in big data and predictive analysis. Multi-chip packing and introduction of IntSim have emerged as the key trends in the global 3D ICs market.

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According to end-use industries, the global 3D ICs market has been categorized into information and communication technology, transport, military, consumer electronics, and others including biomedical applications and research and development. The information and communication technology industry held a 24.2% share in the overall market revenue generated in 2012. During the forecast horizon, the report anticipates the consumer electronics and ICT industries to significantly impact the growth of the global 3D ICs market.

On the basis of product type, the report segments the global 3D ICs market into memories (3D Stacks), RF SiP, HB LED, logic 3D SiP/ SoC, MEMs and sensors, and optoelectronics and imaging. The report projects that memories and MEMs and sensors will lead the 3D ICs market in the future. The increasing popularity of memory-enhanced solutions will propel the growth of the memories segment during the forecast horizon.

The report segments the global 3D ICs market into four key regions: Asia Pacific, Europe, North America, and Rest of the World. Rapidly growing ICT and consumer electronics industries across Asia Pacific are expected to drive the overall growth of the market during the forecast horizon. North America is anticipated to emerge as the second-largest region in the global 3D ICs market.

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Describing the competitive landscape, the report profiles some of the key players in the global 3D ICs market, such as, XILINX Inc., Taiwan Semiconductor Manufacturing Company Ltd., The 3M Company, Tezzaron Semiconductor Corporation, STATS ChipPAC Ltd., Ziptronix Inc., United Microelectronics Corporation, MonolithIC 3D Inc., and Elpida Memory Inc. The report further provides insightful information about the key players including their financial overview, business strategies, and recent developments.

Global 3D ICs Market has been segmented as:

3D ICs Market, By End-Use Sectors:
Consumer electronics
Information and communication technology
Transport (automotive and aerospace)
Military
Others(Biomedical applications and R&D)

3D ICs Market, By Substrate Type:
Silicon on insulator(SOI)
Bulk Silicon

3D ICs Market, By Fabrication Process:
Beam re-crystallization
Wafer bonding
Silicon epitaxial growth
Solid phase crystallization

3D ICs Market, By Product:
MEMS and Sensor
RF SiP
Optoelectronics and imaging
Memories (3D Stacks)
Logic (3D Sip/Soc)
HB LED

3D ICs Market, By Geography:
North America
Europe
Asia Pacific
Rest of World (RoW)

TMR is a global market intelligence company providing business information reports and services. The company’s exclusive blend of quantitative forecasting and trend analysis provides forward-looking insight for thousands of decision makers. TMR’s experienced team of analysts, researchers, and consultants use proprietary data sources and various tools and techniques to gather and analyze information.

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This release was published on openPR.