Underfill Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2016 - 2024

Underfill materials are composite formulations of organic polymers and inorganic fillers which are used in semiconductor packaging to achieve improved thermo mechanical performance. Polymer adhesives are used as underfill material to distribute mechanical stresses at solder joint which occurs due to difference in the thermal expansion coefficients at the interconnect. Various phenolic and amine based epoxy materials are used as underfill material in semiconductor packaging industry. High thermal stability and reworkability are desired characteristics for underfill material in the semiconductor packaging industry. They are used in various packaging techniques such as flip chip, ball grid array (BGA), and chip scale packaging (CSP), etc. Flip chip is a major application for underfill material. Global flip chip market is showing strong demand and is estimated to witness double digit growth in near future. The ever growing demand for lighter, smaller, efficient yet cost effective devices has drawn remarkable attention towards the underfill material. Capillary underfill (CUF), no flow underfill (NUF), and molded underfill (MUF) techniques are used for the application of underfill materials. Due to growing pricing pressure from end use industry, CUF being a conventional and relatively costly technique is replaced by MUF process technique. The global semiconductor packaging industry, a parent market for the global underfill material market is expected to continually expand at high growth rates in near future.

Global Underfill Materials Market Dynamics

Recently, the microelectronic industry is governed by more complex devices, due to trending system on chip (SOC) and system in package (SIP). The trends in portable end use market are driving the global underfill material market growth. The growing demand for low cost, high performing, small in size devices is one of the major driving factors for global underfill material market growth. The increasing use of underfill material from flip chip packaging and wafer level packaging due growing demand in smart phones and tablets is a prominent driving factor for global underfill material market growth. Being a technology driven market, underfill material market is expected to be compelled by the recent advancements in electronic industry. The end use market is posing new requirement of compatibility with lead free solder paste material due latest trend of sustainability in the market. Some of the leading manufacturers in the market are offering underfill material products which are compatible with lead free solder paste.

Get Free Sample Report Copy :
http://www.transparencymarketresearch.com/sample/sample.php?flag=B&rep_id=12911

Global Underfill Material Market Segmentation

The global underfill material market is segmented on the basis of product type and application. On the basis of product type, the global underfill material market is classified as

CUF underfill material
NUF underfill material
MUF underfill Material.
Among these segments, CUF is an oldest type and accounts for maximum share in global underfill market. Due to high cost, the CUF is anticipated to be replaced by MUF materials in near future. The MUF product type segment is estimated to show highest growth in near future.

On the basis of application, the global underfill material market is segmented as

Flip chips
Ball grid array (BGA)
Chip scale packaging (CSP)
The flip chip application segment is expected to exhibit strong demand for underfill material compared to other application segments.

Global Underfill Material Market: Regional Outlook

On the basis of geography, global underfill material market can be divided by major regions which include North America, Western Europe, Eastern Europe, Asia-Pacific Excluding Japan, Japan, Middle East and Africa, and Latin America. Asia Pacific is a largest market for underfill materials with China, Korea, Japan, and Taiwan being prominent countries producing semiconductor packaging materials. North America and Europe are the largest market after Asia.

Global Underfill Material Market Players

Some of the major players in global underfill material market are Henkel, Won Chemicals Co. Ltd., Epoxy Technology Inc., AIM solder, Namics Corporation.

About TMR

TMR is a global market intelligence company providing business information reports and services. The company’s exclusive blend of quantitative forecasting and trend analysis provides forward-looking insight for thousands of decision makers. TMR’s experienced team of analysts, researchers, and consultants use proprietary data sources and various tools and techniques to gather and analyze information.

Contact TMR

90 State Street, Suite 700
Albany, NY 12207
Tel: +1-518-618-1030
USA - Canada Toll Free: 866-552-3453
Email: sales@transparencymarketresearch.com
Website: http://www.transparencymarketresearch.com

This release was published on openPR.