Die Attach Materials Market Size to reach USD 2.51 Billion in 2032-Emergen Research

The global die attach materials market size was USD 1.45 Billion in 2022 and is expected to register a revenue CAGR of 5.3% during the forecast period to the latest analysis by Emergen Research. Rising demand from the semiconductor industry is a major factor driving revenue growth of the market. The semiconductor sector is currently witnessing substantial growth, driven by technological advancements that have made high-end electronic devices more accessible to the general public. This, in turn, is driving revenue growth of the die attach materials market. Over recent decades, electronic products have undergone a significant size reduction, resulting in more compact, lightweight, and portable devices. Furthermore, the shift from analog to digital technology has made electronic devices more cost-effective.

Consequently, there has been a notable rise in the demand for consumer electronic products such as smartphones, tablets, Personal Computers (PCs), wearables, augmented and virtual reality devices, consumer appliances, and various other electronics. Moreover, the proliferation of wireless connectivity technologies such as Wi-Fi, Bluetooth, 5G networks, and others has contributed to an increased need for advanced semiconductor components. In addition, the incorporation of automation across various industries has led to enhanced industrial processes, encompassing manufacturing, warehousing, industrial data management, and the adoption of industry 4.0 technologies. These developments have further driven the semiconductor industry, consequently creating a high demand for die attach materials.

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However, the worldwide COVID-19 pandemic led to the shutdown of a considerable number of factories, including those involved in the global production of electronic goods. As a consequence, there was a notable decline in the demand for die attach machines. Moreover, the semiconductor shortage brought about by the lockdowns related to the pandemic had a severe impact on the semiconductor industry, resulting in a significant setback in the progress of the die attach materials market. Factors such as volatile cost fluctuations of the vital raw materials needed for building die attach machines and shortages of crucial materials such as silicon are expected to impose limitations on revenue growth of the die attach materials market.

Some major companies in the market report include Sunwoda Electronic Co., Ltd., Panasonic Holdings Corporation, LG Energy Solution, Contemporary Amperx Technology Co. Ltd., BYD Company Ltd., Huber Die Attach Materials Batterys LLC, Tesla, C4V, BMW AG, and Hozon New Energy Automobile Co. Ltd.

Some Key Highlights from the Report

• The die bonder segment is expected to register a significantly fast revenue growth rate during the forecast period. Die bonders are precision machines, either semi-automatic or fully automatic, that play a specialized role in the manufacturing of semiconductor devices. Their primary function is to securely affix the semiconductor chip, commonly known as the 'die,' to the substrate, package, or lead frame, typically using adhesive glue, a controlled clean room environment, eutectic material, or solder.

• The epoxy segment is expected to register a substantial revenue growth rate over the forecast period. This technology allows for a greater quantity of Input/Output (I/O) connections, as the entire surface of the die can be employed for these connections. Owing to the shorter interconnection pathways compared to wire bonds, it has the potential to increase the device's speed. Moreover, eliminating wire bond loops, leads to a more streamlined and compact device design.

• The Light Emitting Diode (LED) segment accounted for a major revenue share in 2022. In LED applications, it is a common practice to use die attach materials to bond the LED chip to a substrate, which is typically crafted from ceramics, metals, or Printed Circuit Boards (PCBs). The selection of the die attach material carries significant importance for a variety of compelling reasons.

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Die Attach Materials Market segmentation
Emergen Research has segmented the global die attach materials market on the basis of type, technique, application, and region:
• Die Attach Materials Type Insights: (Revenue in USD Billion & Volume in Thousand Units; 2019-2032)
o Die Bonder
o Flip Chip Bonder

• Die Attach Materials Technique Insights: (Revenue in USD Billion & Volume in Thousand Units; 2019-2032)
o Soft Solder
o Eutectic
o Epoxy
o Others

• Die Attach Materials Application Insights: (Revenue in USD Billion & Volume in Thousand Units; 2019-2032)
o Optoelectronics
o RF & MEMS
o CMOS Image Sensors
o Logic
o LED
o Memory
o Others

• Die Attach Materials Regional Insights: (Revenue in USD Billion & Volume in Thousand Units; 2019-2032)
o North America
1. U.S.
2. Canada
3. Mexico
o Europe
1. Germany
2. France
3. U.K.
4. Italy
5. Spain
6. Benelux
7. Rest of Europe
o Asia Pacific
1. China
2. India
3. Japan
4. South Korea
5. Rest of APAC
o Latin America
1. Brazil
2. Rest of LATAM
o Middle East & Africa
1. Saudi Arabia
2. UAE
3. South Africa
4. Turkey
5. Rest of MEA

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