Lanner Further Expands Carrier-grade Network Appliances HCP-72i2 for Telecom Applications
HCP-72i2 is built with a full modular-design, by offering two rear-accessible Intel x86 CPU blades and three front-swappable network blades in a 2U rackmount server. In fact, the three networking I/O blades are hot-swappable through LCM control. This allows high-scalability in telecom applications as the modular blades perform offload duties.
The CPU blades are empowered by Intel® Xeon® processor E5-2690 v3 series CPU and C612 chipset (Haswell-EP) for extreme high-performance and data processing capability. Meanwhile, regarding data memory, HCP-72i2 supports qual-channel DDR4 at 2,133 MHz registered socket with maximum capacity up to 512GB (16 x DIMM sockets for each blade). This hardware blade design ensures ultra low latency and extreme processing power to maximize virtualization related performance.
In terms of networking I/O density, HCP-72i2 delivers up to 36 x GbE SFP or 24 x 10GbE SFP+, while keeping one management port and one IPMI port.
For deployments in telecom industries, HCP-72i2 is compliant with NEBS and FIPS standards. Regarding high-availability in 24/7 operations, HCP-72i2 is designed with redundant power supply.
About Lanner Electronics Inc.
Lanner Electronics Inc. (TAIEX 6245) is a world-leading hardware provider in design, engineering, and manufacturing services for advanced network appliances and rugged industrial computers.
With 30-year experiences, Lanner provides reliable and cost-effective computing platforms with high quality and performance. Today, Lanner has a large and dynamic manpower of over 800 well-experienced employees worldwide with the headquarters in Taipei, Taiwan and subsidiaries in the US, Canada, and China.
Lanner Electronics Inc
7F, 173 Datong Road Section 2,Xizhi District,New Taipei City 22184,Taiwan
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