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Die Attach Machine Market Surges Ahead Driven by Technological Advancements and Demand from Diverse Industries 2031

09-12-2023 12:58 PM CET | Industry, Real Estate & Construction

Press release from: Allied Market Research

Die Attach Machine Market

Die Attach Machine Market

Introduction -

The die attach machine market has been experiencing remarkable growth, largely fueled by the increasing demand for semiconductor assembly equipment and machinery. In 2021, the die bonder segment emerged as the dominant player, driven by surging demand from industries such as semiconductor equipment and chip assembly. This article explores the dynamics of the die attach machine market, highlighting key segments, applications, and the driving forces behind its expansion.

The die attach machine market size was valued at $1.2 billion in 2021, and is estimated to reach $2.1 billion by 2031, growing at a CAGR of 5.9% from 2022 to 2031.

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Segmentation by Machine Type
The die attach machine market comprises primarily two commonly observed types: flip chip bonders and die bonders. In 2021, die bonders accounted for the largest market share by revenue, and this growth can be attributed to their extensive usage across various industries. Die bonders play a pivotal role in ensuring precise attachment of semiconductor chips, making them indispensable in semiconductor manufacturing.

Applications of Die Attach Machines
The market analysis extends to various applications of die attach machines, including RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. In 2021, the LED segment stood out, claiming a significant market share in terms of revenue. The heightened demand for LED displays, LEDs themselves, and products incorporating LED circuits contributed to this substantial growth. Furthermore, the optoelectronics segment is expected to grow at a higher Compound Annual Growth Rate (CAGR) during the forecast period. This growth can be attributed to the rise in semiconductor industrial projects and the increasing initiatives for smart cities that rely on optoelectronic components.

Market Drivers

The die attach machine market is primarily driven by two key factors. Firstly, global economic growth acts as a significant catalyst, creating a favorable environment for increased semiconductor manufacturing activities. Secondly, advancements in hybrid chip technology and the semiconductor memory industry have spurred the demand for die attach machines. The pursuit of faster, more efficient, and smaller semiconductor devices has necessitated the use of advanced assembly equipment.

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Growth in Developing Countries and Strategic Partnerships

Over the past decade, the die attach machine market has witnessed significant growth, largely due to the rise in semiconductor manufacturing activities in developing countries and the growing demand for semiconductor assembly equipment and machinery. Additionally, key players in the die attach machine industry are strategically partnering with other companies to strengthen their global market presence. For example, in October 2020, BE Semiconductors Industries N.V. formed a joint venture with Applied Materials. This collaboration aims to accelerate Chip Integration Technology for Die-based Hybrid Bonding in equipment solutions, reflecting the industry's commitment to innovation and competitiveness.

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Top Runners:
ASM Pacific Technology Limited, Fasford Technology Co. Limited, MicroAssembly Technologies Limited, BE Semiconductor Industries N.V, Kulicke and Soffa Industries, Panasonic Industry Co., Ltd., Inseto UK Limited, Palomar Technologies, Dr. Tresky AG, Shinkawa Limited

Conclusion
The die attach machine market is thriving on the back of its pivotal role in semiconductor manufacturing across diverse industries. The die bonder segment leads the market, with applications encompassing LED manufacturing and optoelectronics. As global economic growth continues and semiconductor technology advances, the demand for die attach machines is poised for sustained growth. Strategic partnerships between industry players are driving innovation and market expansion. As the quest for smaller, faster, and more efficient semiconductor devices intensifies, the die attach machine market is set to play a crucial role in shaping the future of the semiconductor industry.

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Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

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