Chip Mounter Market to Reach US$ 8.3 Billion by 2028, Fostered by Thriving Consumer Electronics Sector
A chip mounter determines the automation degree and ensures the manufacturing efficiency of the surface mount technology (SMT) assembly line. It utilizes SMT and through-hole technology (THT) to mount chips on substrates that are widely used to design miniature electronic devices and help in reducing the dimensions of integrated circuits. It also assists in the manufacturing of printed circuit boards (PCB) and provides flexibility and high-density mounting resulting in small packaging sizes. Since its utilization can handle a variety of board sizes and thicknesses, making them ideal for production processes requiring small to medium batch runs or large volumes. As a result, it is widely utilized across various industry verticals, such as the medical, telecommunications, and automotive sectors.
As the novel coronavirus (COVID-19) crisis takes over the world, we are continuously tracking the changes in the markets, as well as the purchase behaviors of the consumers globally-our estimates about the latest market trends and forecast values after considering the impact of this pandemic.
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Significant growth in the semiconductor industry is driving the global market. Moreover, the increasing demand for consumer and medical electronics and automotive and telecommunications equipment is contributing to the overall demand for chip mounters. In response to the escalating demand, numerous major companies are developing innovative chip mounters for managing multiple circuitries inside a single chip, which is augmenting the overall market. Furthermore, the rising demand for laptops and smartphones, growing internet penetration, and automation in household electronic goods are creating a positive market outlook. Other factors, including rapid industrialization and extensive research and development (R&D) activities conducted by key players, are also influencing the market.
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Competitive Landscape with Key Players:
• Hitachi, Ltd.
• Samsung Electronics
• Panasonic Corporation
• Juki Corporation
• ASM Pacific Technology Limited Canon Inc.
• Essemtec AG
• Ohashi Engineering
• Nordson Corporation
• Sony Corporation
• SUN Electronic Industries Corporation
• TOA Corporation.
Breakup by Technology:
• Hole Technology
• Surface Mount Technology
• Fine Pitch Technology
Breakup by Application:
• Consumer Electronics
Breakup by Region:
• North America (United States, Canada)
• Europe (Germany, France, United Kingdom, Italy, Spain, Others)
• Asia Pacific (China, Japan, India, Australia, Indonesia, Korea, Others)
• Latin America (Brazil, Mexico, Others)
• Middle East and Africa (United Arab Emirates, Saudi Arabia, Qatar, Iraq, Other)
Key Highlights of the Report:
• Market Performance
• Market Outlook
• Porter's Five Forces Analysis
• Market Drivers and Success Factors
• SWOT Analysis
• Value Chain
• Comprehensive Mapping of the Competitive Landscape
Note: If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.
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