Photonic Packaging Market To Reach Us$ 452.3 Billion By The End Of 2032

The global photonic packaging market was valued at US$ 258.7 billion in 2022 and is expected to grow at a 5.7% CAGR to US$ 452.3 billion by the end of 2032.

At the end of 2021, photonic packaging sales accounted for nearly 32% of the global photonic market.

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Photonic Packaging Market: Competition Analysis

Aim Photonics, Boschman, Fiberoptics Technology Inc, IBM, Inphotec, Juniper Networks, Keysight, MSRI Systems, PHIX, Technobis, Tyndall National Institute, and VLC Photonics are among the leading photonic packaging manufacturers.

Photonic packaging's low speed and high cost are most likely causing a significant bottleneck in the production of competitive photonic equipment. Big multi-national players enter the Si-photonics segment as key market players work to bring equipment to market. In addition, there is a growing need to develop automated and intelligent optical packaging processes to allow for higher volume production.

• MRSI Systems introduced 'MRSI-S-HVM' in its new offering in September 2020. Wafer-level packaging, co-packing photonic and electronic chips, and a flexible 0.5 micrometre die bonder for silicon photonics are among its features.
• In January 2022, Phix, a photonics packaging company, and Nanoscribe announced a partnership to provide on-fiber printing services to the photonic packaging industry. Phix is combining Nanoscribe's nano-precision alignment capabilities with new high-performance 3D microlens printing technology to create standard lensed fibre arrays (LFAs).

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Segmentation of Photonic Packaging Industry Research

• By Packaging Material :
o Silicon-based
o Gallium-based
o Others
• By Packaging Technology :
o Optical
o Electrical
o Thermal Management
o Mechanical
• By Packaging Structure :
o Single-chip
 Area-array Packages (Ball Grid Arrays)
 Surfacemount Packages (Quad-flat Packages)
 Direct-chip Mounting
 Dual-in-line Packages
o Mutli-chip
• By Mode :
o Single Mode
o Mutli-mode
• By Application :
o LiDAR & Imaging Devices (Optical Imaging)
o LiFi (Light Fidelity)
o Optical Sensors & Photodetectors
o Photodiodes
o Optical Communication Systems & Networking Components
o Optoelectronic Devices
o Others

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• By End Use Industry* :
o Components & Materials
o Mobility
o Discrete Manufacturing
o Environment, Energy & Lighting
o Healthcare & Life Science
o Telecommunications
o Aerospace & Defense
o Consumers & Professionals
o Others
(*On the basis of components used)
• By Region :
o Americas
o EMEA
o Asia Pacific

Crucial Questions Answered in the Report

• Which end-use industry remains the top consumer of Cordless Impact Wrench in different regional markets?
• At what rate has the global Photonic Packaging Market been expanding during the forecast period?
• How will the global Photonic Packaging Market look like by the end of the forecast period?
• What innovative technologies are the Photonic Packaging Market players adopting to stay ahead of the pack?
• What are the restraints affecting the growth of the global Photonic Packaging Market?

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