Semiconductor Packaging Material Market Trends, Business Overview, Industry Growth and Forecast to 2028

The global semiconductor packaging material market is anticipated to grow at 9.3% CAGR during the forecast period (2022-2028). The rise of the Internet of Things (IoT) technology, increased penetration of consumer electronics products, and growing tendencies toward semiconductor wafers in the automobile industry are all major factors driving the semiconductor packaging market. However, changing trends toward fan-out wafer-level packing is projected to boost the semiconductor packaging market's growth.

Semiconductor packaging is critical for safeguarding IC chips from the environment and maintaining electrical connectivity for chip mounting on printed circuit boards. The rapid advancement of electronics technology, such as AI and cloud computing, is complemented by a high demand for high-speed, high-integration, and low-power integrated circuits (ICs). Semiconductor packaging is a protective casing that protects silicon wafers, logic units, and memory from physical damage and corrosion during the final stages of the semiconductor manufacturing process. It makes it possible to connect the chip to a circuit board. These packages combine a number of different approaches, including 2.5D and 3D packaging, fan-out-wafer-level packaging, and system-in-package.

Due to different ICs having distinct packaging requirements, the semiconductor packaging market has more growth potential than the traditional packaging business. For instance, more than 3000 distinct package shapes and sizes are available from Amkor. Packages range from typical Leadframe ICs for through-hole and surface mounting to those needed for high pin count and high-density applications such stacked-DIE, wafer level, MEMS, Optical, Flip Chip, Through Silicon Via (TSV), and 3D Packaging.

Furthermore, modern packaging protects components against mechanical damage, cooling, RF noise emission, and electrostatic discharge in consumer electronics and industrial devices by relying on mechanical engineering principles such as dynamics, stress analysis, heat transfer, and fluid mechanics. As a result, sophisticated packaging technology is being employed for semiconductor packaging to increase the performance, reliability, and cost-effectiveness of electronics systems. With the rapid growth of the semiconductor packaging market, particularly fan-out wafer-level packaging, as well as the rise in demand for smartphones, devices, and the IoT, semiconductor packaging suppliers are developing processes and methods to lower the overall cost of advanced packaging while maximizing operational efficiency.

Semiconductor packaging technology is supposed to offer value to a semiconductor product by boosting and sustaining performance while lowering the overall cost of packaging. High-performance chips for various consumer electrical items are being demanded as a result of the development of semiconductor packaging. The demand for 3D and 2.5D packaging chips used in smartphones and other mobile devices will increase as a result.

Some major players in the market include Amkor Technology, Inc., Powertech Technology, Inc., Fujitsu Ltd., Intel Corporation, Samsung Electronics Co., Ltd., among others. The market players are contributing significantly to the growth of the market by the adoption of various strategies including mergers & acquisitions, geographical expansion, partnerships and collaborations, and new product launches, to stay competitive in the market. For instance, in November 2020 the second phase of the US Department of Defense's State-of-the-Art Heterogeneous Integration Prototype (SHIP) program has been awarded to Intel Federal LLC of Santa Clara, California. The SHIP initiative allows the US government to use Intel's state-of-the-art semiconductor packaging capabilities in Arizona and Oregon, as well as the capabilities produced by Intel's annual R&D and production expenditure of tens of billions of dollars.

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Market Coverage
•The market number available for - 2021-2028
•Base year- 2021
•Forecast period- 2022-2028
•Segment Covered-
•By Type
•By Packaging Material
•By Technology
•By End-User
•Regions Covered-
•North America
•Europe
•Asia-Pacific
•Rest of the World

Competitive Landscape- Amkor Technology, Inc., Powertech Technology, Inc., Fujitsu Ltd., Intel Corporation, Samsung Electronics Co., Ltd., among others.

A full report Semiconductor Packaging Material Market of is available at:  https://orionmarketreports.com/semiconductor-packaging-material-market/96541/

Global Semiconductor Packaging Material Market Report by Segment
By Type
•Flip Chip
•Embedded DIE
•Fan-In WLP
•Fan-Out WLP
By Packaging Material
•Organic Substrate
•Bonding Wire
•Leadframe
•Others (Ceramic Package)
By Technology
•Grid Array
•Small Outline Packages
•Flat No-Leads Packages
•Dual In-Line Package
•Ceramic Dual Inline Package
•Others
By End-User
•Consumer Electronics
•Automotive
•Healthcare
•IT & Telecommunication
•Aerospace & Defense
•Others

Key questions addressed by the report
•What is the market growth rate?
•Which segment and region dominate the market in the base year?
•Which segment and region will project the fastest growth in the market?
•How has COVID-19 impacted the market?
•Deviation from the pre-COVID-19 forecast
•Most affected region and segment
•Who is the leader in the market?
•How players are addressing challenges to sustain growth?
•Where is the investment opportunity?

 

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This release was published on openPR.