SU-MIMO Wi-Fi Chipset Market 2021 Global Manufacturers – Qualcomm Technologies(US), MediaTek(Taiwan), Intel Corporation (US), Texas Instruments Incorporated

The SU-MIMO Wi-Fi Chipset Market report provides the overall structure and business outlook of the global and regional industries. The study also involves the important Achievements of the market, Research & Development, new product launch, product responses, and regional growth of the leading competitors operating in the market on a global and local scale. This study provides information about the growth and revenue during the historic and forecasted period of 2026 to 2027. The structured analysis contains graphical as well as a diagrammatic representation of the global SU-MIMO Wi-Fi Chipset Market with its specific geographical regions.

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“SU-MIMO Wi-Fi Chipset Market should grow from $3.4 billion in 2021 to $9.1 billion by 2026, at a compound annual growth rate (CAGR) of 21.10% for the period of 2021-2026.”

Top leading Companies Profiled in SU-MIMO Wi-Fi Chipset Market Report are Qualcomm Technologies(US), MediaTek(Taiwan), Intel Corporation (US), Texas Instruments Incorporated. (US), STMicroelectronics (Switzerland), Cypress Semiconductor Corporation (US), Marvell Technology Group(Bermuda), Samsung Electronics(South Korea), Quantenna Communications(US), Peraso Technologies(Canada),

Industry Recent Developments and Updates

Broadcom Announces World’s First Wi-Fi 6E Chip for Mobile Devices- SAN JOSE, Calif., Feb. 13, 2020 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the world’s first Wi-Fi 6E client device, the BCM4389. Wi-Fi 6E extends the Wi-Fi 6 standard to support the soon-to-be-operational 6 GHz band with wider 160 MHz channel bandwidths that double Wi-Fi speeds and cut latency in half compared to Wi-Fi 5. The BCM4389 delivers over 2 Gbps of real-world speeds and up to five times better battery utilization, making it an ideal solution for flagship smartphones and future AR/VR devices.

Jan 8, 2019 MediaTek Launches Newest Combo Chip with Wi-Fi 6 and AP+Bluetooth- MediaTek today announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology - Wi-Fi 6 (802.11ax) - for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home.

OCT 20, 2015 Qualcomm Introduces Industry’s First Wave 2 802.11ac Wi-Fi System-on-Chip for Routers, Gateways and Access Points- Qualcomm Incorporated (NASDAQ: QCOM) through its subsidiary, Qualcomm Atheros, Inc., today introduced the industry’s first fully integrated, smart gateway system-on-chip (SoC) incorporating its next generation Qualcomm® Internet Processor (IPQ), Qualcomm® VIVE™ with Qualcomm® MU | EFX MU-MIMO technology, built-in Gigabit Ethernet, Qualcomm® StreamBoost™, with support for dual band simultaneous (DBS) transmission and LTE backhaul.

June 1, 2015 Marvell Launches Industry's Smallest, Most Power Efficient, MU-MIMO Wireless Connectivity Combo for Enterprise and Consumer Markets- arvell (NASDAQ:MRVL) - a worldwide leader in providing complete silicon solutions from mobile communications to storage, Internet of Things (IoT), cloud infrastructure, digital entertainment, in-home content delivery and Kinoma® software enabling the “Smart Life and Smart Lifestyle” – today announced the Marvell® Avastar® 88W8997 System-on-Chip (SoC), the industry’s smallest, most power efficient, MU-MIMO wireless connectivity combo for enterprise and consumer markets. The 88W8997 is the industry’s first 28nm 2x2 802.11ac Wave-2 combo with full support for Bluetooth® v4.2,as well as additional planned enhancements of Bluetooth technology including features such as longer range, higher speeds, and mesh networking for increased Internet of Things (IoT) functionality.

Market Research Study Focus on these Types:

802.11ay

802.11ax

802.11ac Wave 2

Others

Market Research Study Focus on these Applications:

Smartphones

Tablet

PCs

Access Point Equipment

Connected Home Devices

Others

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Regional Analysis:

Asia-Pacific (China, India, Japan, South Korea, Australia, Indonesia, Malaysia, and Others), North America (United States, Canada, and Mexico), Central & South America (Brazil, and Rest of South America), Europe (Germany, France, UK, Italy, Russia, and Rest of Europe), Middle East & Africa (GCC Countries, Turkey, Egypt, South Africa and Other)

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Key Takeaways from SU-MIMO Wi-Fi Chipset Report

─Evaluate market potential through analyzing growth rates (CAGR %), Volume (Units) and Value ($M) data given at country level – for product types, end use applications and by different industry verticals

─Understand the different dynamics influencing the SU-MIMO Wi-Fi Chipset market – key driving factors, challenges and hidden opportunities.

─Get in-depth insights on your competitor performance – SU-MIMO Wi-Fi Chipset market shares, strategies, financial benchmarking, product benchmarking, SWOT and more

─Analyze the sales and distribution channels across key geographies to improve top-line revenues.

─Understand the industry supply chain with a deep dive on the value augmentation at each step, in order to optimize value and bring efficiencies in your processes.

─Get a quick outlook on the market entropy – M&A’s, deals, partnerships, product launches of all key players for the past 4 years.

─Evaluate the supply-demand gaps, import-export statistics and regulatory landscape for more than top 20 countries globally for the SU-MIMO Wi-Fi Chipset

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In conclusion, the SU-MIMO Wi-Fi Chipset market report presents the descriptive analysis of the parent market supported elite players, present, past and artistic movement information which is able to function as a profitable guide for all the SU-MIMO Wi-Fi Chipset Industry business competitors. Our expert research analyst’s team has been trained to provide in-depth market research reports from every individual sector which will be helpful to understand the industry data in the most precise way.

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