3D IC & 2.5D IC Packaging Market Size, Share & Forecast 2025

2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.

3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).

Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.

In 2019, the market size of 3D IC & 2.5D IC Packaging is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.

In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC & 2.5D IC Packaging.

This report studies the global market size of 3D IC & 2.5D IC Packaging, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).

This study presents the 3D IC & 2.5D IC Packaging production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.

For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

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In global market, the following companies are covered:

Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering


Market Segment by Product Type

3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)


Market Segment by Application

Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies


Key Regions split in this report: breakdown data for each region.

United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-31A154/global-united-states-european-union-and-china-3d-ic-2-5d-ic-packaging

The study objectives are:

To analyze and research the 3D IC & 2.5D IC Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key 3D IC & 2.5D IC Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market


In this study, the years considered to estimate the market size of 3D IC & 2.5D IC Packaging are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025

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